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A high-temperature furnace is used in the silicon wafer annealing process to release silicon’s tension. The silicon-silicon dioxide interface’s interface charge is decreased, structural flaws and stress are reduced, and dopants with ions embedded in them are activated.
The following uses of silicon wafer annealing are:
Fabricating silicon wafers that have been annealed has a number of benefits. In the beginning, the silicon utilised in the process is highly pure and less likely to include heavy metals.
It may also be handled quickly, which is the second benefit. Third, annealed silicon wafers are more affordable than unannealed ones.
The Global Annealed silicon Wafer market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
The utilisation of hydrogen-annealed wafers in high-performance logic chip manufacturing has shifted from being primarily employed in memory fabs.
Toshiba Ceramics Co. Ltd. hydrogen-annealed Hi-Wafer substrates have been approved for use with 0.18-micron CMOS processes.
Officials at Toshiba Ceramics stated that they think hydrogen-annealed wafers would replace more expensive epitaxial silicon substrates as a practical substitute for advanced logic techniques.
Because epi wafers have fewer faults and gaps in their crystal lattices than other substrates, they have become the preferred choice for many deep-submicron logic ICs, including microprocessors.
Polished bulk wafers are frequently no longer good enough to support high-performance circuitry.
