By submitting this form, you are agreeing to the Terms of Use and Privacy Policy.
Power Modules frequently use ceramic substrates because of their special thermal, mechanical, and electrical characteristics, which make them perfect for demanding power electronics applications.
These substrates support a system’s ability to perform electrically by offering mechanical stability and higher thermal performance to satisfy the demands of each individual design.
In a power electronics circuit, ceramic substrates are typically found within the copper/metal layers of a power module. They help a PCB accomplish its intended job as effectively as possible by performing a similar function.
Selecting a ceramic substrate over others made of metal or plastic has various benefits. Richard Curamik Superior thermal characteristics, including strong heat conductivity, increased thermal spreading, and prolonged heat capacity, are provided by ceramic substrates.
They are ideal for the most demanding applications thanks to their low coefficient of thermal expansion, which also provides a number of mechanical advantages.
Additionally, they offer sturdy electrical insulation to shield people from the electrical system.Many enhancements in car comfort and safety features are driven by advances in vehicle electrification.
To satisfy a rising consumer demand for low emissions automobiles, automakers are also particularly interested in electrifying car powertrains from mild hybrid to fully electric vehicles.
The Global EV Ceramic substrates Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
An application-appropriate substrate material is needed for designing power circuits. New applications, such as power modules for electric vehicles (EVs) and hybrid electric vehicles (HEVs), demand higher voltage and power from smaller circuits, necessitating the use of circuit materials that can provide high voltage isolation while effectively dissipating heat from densely packed semiconductor devices like IGBTs and MOSFETs.
The necessary qualities are present in ceramic substrate materials, however not all ceramic substrates are created equal. For instance, there are several methods for attaching copper to ceramic, such as direct bond copper (DBC) or active metal brazing (AMB) procedures.
When choosing a ceramic substrate for an application that requires high voltage handling, high isolation, and effective heat dissipation, understanding how ceramic substrates differ might be helpful.
