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The integrated circuit is put on a substrate and attached to the package’s pins or balls using a variety of solder balls in a process known as ball grid array (BGA) packaging. On the bottom of the package, the solder balls are normally placed in a grid pattern.
In comparison to other packaging technologies, BGA packaging has a number of benefits. The device and substrate can be connected at a higher density, enabling the creation of circuits with greater complexity and performance.
Due to the shorter and more direct connections between the device and the substrate, it also provides better thermal and electrical performance. Finally, because it is less vulnerable to pressures, it is a more dependable packaging method.
BGA packaging is frequently utilised in many electronic applications, such as FPGAs, memory devices, and microprocessors. Due to the tiny size of the solder balls and the requirement for specialist equipment to handle and check the packages, it is additionally more challenging to assemble and repair than conventional packaging technologies.
Global ball grid array (BGA) packaging market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
In the search results, the effect of COVID-19 on the Ball Grid Array (BGA) packaging market is not made clear. The global BGA market, however, is anticipated to expand throughout the course of the projected period. The low price, denser type of packing, and superior performance of BGAs drive the market.
The BGA business is expanding in part because to the rising need for a variety of packaging options in smaller sizes.
The BGA market is well-established for the semiconductor industry in Asian nations like China, Taiwan, Hong Kong, and Japan. As a result, it is anticipated that the BGA market would experience rapid growth over the forecast period.
