By submitting this form, you are agreeing to the Terms of Use and Privacy Policy.
Electronic assembly materials are a diverse range of substances used in the manufacturing and assembly of electronic components and devices.
These materials play a crucial role in ensuring the reliability, performance, and longevity of electronic products.
They are used at various stages of the electronic manufacturing process, from initial circuit fabrication to final assembly and packaging.
The Global Electronic Assembly Materials market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
https://www.itweae.com/applications/electronic-assembly-materials/adhesives
NextFlex Launches Flexible Hybrid Electronics Innovations to Address Manufacturing Challenges and Expand Technology Adoption.
The newest request for proposals from NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, seeks to fund initiatives that advance the development and deployment of FHE while solving significant issues in advanced manufacturing and supporting Department of Defence priorities.
In PC 7.0, broad topic definitions are still used to enable a diverse proposer base, building on the success and maturity of previous Project Calls.
Special emphasis is placed on areas in which FHE can influence high priority U.S.
manufacturing opportunities and areas of emerging importance within the FHE community.
The focus is on FHE enabled manufacturing for automotive applications, additive approaches to FHE device fabrication, hybrid electronic manufacturing applications in advanced packaging, and investigating how FHE manufacturing can support increased environmental sustainability in electronics manufacturing.
The introduction of NextFlex’s FHE Technology Roadmaps is also announced.
The NextFlex Technical Working Groups update the roadmaps in 11 technical areas of emphasis – automotive, device integration & packaging, materials, modelling & design, printed components & microfluidics, standards, test & reliability, asset monitoring systems, flexible power, human monitoring systems, integrated antenna arrays, and soft wearable robotics.
These areas were developed by subject matter experts from industry, academia, and government.
However, this is the first occasion a public version of the roadmaps has been made accessible.
The roadmaps include comprehensive data on the state of the art at the time, market opportunities and demands, significant stakeholders, development roadmap, and prioritised technical gaps determined by each Technical Working Group.
The priorities for NextFlex Project Calls are determined by these roadmaps.
