Semiconductors Beyond the GPU: Power, Analog, RF, Embedded, Automotive, Space-Grade and Photonic Chips

Semiconductors Beyond the GPU: Power, Analog, RF, Embedded, Automotive, Space-Grade and Photonic Chips

The Device Markets Behind Electrification, Industrial Automation, Connectivity and the New Space Economy

Mobility Foresights Technology Research | Hub Analysis | September 2026

AI accelerators dominate headlines, but most semiconductor units and a large share of industry revenue come from other devices. These are the power, analog, RF, microcontroller, automotive, space-grade and photonic chips that make electrification, automation and connectivity possible. Four forces are reshaping them:

  • Wide-bandgap materials such as silicon carbide (SiC) and gallium nitride (GaN) are replacing silicon in power conversion.
  • Vehicles are consolidating dozens of electronic control units into zonal and central computers.
  • Low-Earth-orbit constellations have created volume demand for radiation-tolerant electronics.
  • Export controls and supply-chain de-risking are pushing customers to qualify second sources outside a single country.

This hub brings together 88 Mobility Foresights market studies across eight areas: power semiconductors; analog, mixed-signal and power management; RF and wireless connectivity; MCUs, processors, FPGAs and ASICs; automotive semiconductors; radiation-hardened and space electronics; lasers and photonics; and emerging devices.

Key Takeaways

  • Wide-bandgap power devices are taking share across every conversion market. GaN is gaining in chargers, solar and data centers, SiC in EV and high-voltage inverters, and gallium oxide and diamond are emerging next.
  • Analog is becoming a supply-security product. Defense-grade and China-independent precision analog are funded procurement priorities.
  • Connectivity chips are multiplying. Wi-Fi 7, sub-GHz IoT, Matter and direct-to-satellite links all need new radios.
  • Automotive silicon content is rising with zonal architecture. Functional-safety requirements favor qualified suppliers.
  • Space and photonics are high-growth niches. Rad-hard GaN, space power converters, ultrafast lasers and thin-film lithium niobate are scaling from specialty to volume.

How We Segment Semiconductor Devices

SegmentWhat is changingReports
1. Power semiconductorsGaN, SiC, bidirectional switches, gallium oxide and diamond7
2. Analog, mixed-signal & power managementPrecision analog, supply security, sensing interfaces15
3. RF & wireless connectivityWi-Fi 7, sub-GHz IoT, Matter, satellite, THz12
4. MCUs, processors, FPGAs & ASICsAI MCUs, RISC-V, FD-SOI, security FPGAs11
5. Automotive semiconductorsZonal architecture, ASIL safety, electrification control10
6. Rad-hard, space & defense electronicsRad-hard GaN, space power, star trackers11
7. Lasers & photonicsUltrafast and UV lasers, lithium niobate, far-UVC15
8. Emerging devicesNeuromorphic, MRAM, nanowire and 2D transistors, quantum7

1. Power Semiconductors: GaN, SiC and Beyond

Wide-bandgap semiconductors switch faster and waste less energy than silicon, shrinking power converters and improving efficiency. SiC entered mass-market EVs in 2018 and now dominates 800-volt traction inverters. The SiC-based high-voltage inverter market report covers its use in EVs, rail, solar and industrial drives. GaN is winning in lower-voltage, high-frequency applications:

The next materials are further out. The gallium oxide (Ga2O3) power semiconductor market report covers an ultra-wide-bandgap material that can be grown from melt, potentially at lower cost than SiC. The diamond semiconductor materials market study covers diamond, which offers exceptional thermal conductivity and breakdown strength but remains early-stage.

2. Analog, Mixed-Signal and Power Management

Analog chips convert real-world signals such as temperature, pressure, sound and current into data, and manage power. They are long-lived products with high switching costs, which makes supply security a priority. Four reports cover precision analog:

Two reports cover industrial sensing:

Power management and protection devices appear in almost every product:

3. RF and Wireless Connectivity

Wireless standards are multiplying across home, industry and space. Wi-Fi 7 certification began in 2024, and the Matter smart-home standard, launched in 2022, is unifying device interoperability. Four reports cover the chips:

Long-range and satellite links are growing:

Frequency generation and higher bands:

4. MCUs, Processors, FPGAs and ASICs

Microcontrollers are becoming AI-capable. The AI MCU (microcontroller) market report covers MCUs with built-in neural accelerators for sensing, voice and vision at the edge. Three reports cover industrial processors:

Programmable and custom logic:

5. Automotive Semiconductors

Vehicles are replacing distributed electronic control units with zonal controllers and central computers, and electrification adds high-voltage power electronics. Three reports cover the architecture:

Electrification electronics:

6. Rad-Hard, Space and Defense Electronics

Large low-Earth-orbit constellations have changed space electronics from a handful of exquisite satellites to production volumes. Radiation-hardened GaN is replacing older silicon power devices:

Power and control on satellites:

Defense RF uses the same technology base. The gallium nitride (GaN) defense power amplifiers market report covers amplifiers for radar, EW and communications. The low-SWaP RF front-end modules market study covers compact, low size-weight-and-power modules for drones, missiles and soldier radios.

7. Lasers and Photonics

Lasers are essential tools in manufacturing. Ultrafast lasers deliver pulses of picoseconds or femtoseconds that remove material without heat damage. Six reports cover the tools:

Photonic components:

Ultraviolet is a distinct niche. The far-UVC LED market report covers 222 nm-class light sources studied for disinfecting occupied spaces. The ultraviolet (UV) disinfection chip market study covers UV-C LEDs for water and surface disinfection.

8. Emerging Devices and Quantum

Several device technologies are moving from research toward products:

Where Value Is Created: The Device Value Chain

Value-chain stageCurrent bottleneckMost exposed segments
Substrates & materialsSiC and GaN wafer quality and cost; gallium export controlsPower, RF, rad-hard
Specialty fabsMature-node and compound-semiconductor capacityAnalog, power, RF
QualificationAutomotive, space and defense qualification timelinesAutomotive, rad-hard, defense analog
Design IPRISC-V ecosystem maturity; security certificationMCUs, SoCs, FPGAs
Photonics manufacturingThin-film lithium niobate and laser yieldLasers, photonic circuits

Regional perspective

  • United States. Leads in analog, FPGA, RF and defense electronics, with CHIPS Act funding for domestic capacity.
  • Europe. A power-semiconductor and automotive-chip leader, particularly in SiC, MCUs and sensors, supported by the EU Chips Act.
  • Japan. Strong in power devices, optoelectronics and materials.
  • China. The largest consumer of many device types and rapidly expanding domestic mature-node, SiC and GaN production.
  • Taiwan and South Korea. Key foundry, packaging and component suppliers.

What to Watch Through 2032

  1. 200 mm SiC transition: cost reduction and industry restructuring in SiC substrates.
  2. GaN in data centers and EVs: penetration into higher-power applications.
  3. Zonal architecture timing: adoption across mass-market vehicle platforms.
  4. RISC-V in safety-critical markets: qualification in automotive and industrial applications.
  5. Gallium and germanium supply: export controls and new non-Chinese production.

Frequently Asked Questions

What is the difference between SiC and GaN?

Both are wide-bandgap semiconductors that switch more efficiently than silicon. SiC is favored at high voltage and power, such as EV traction inverters, while GaN excels at high frequency and lower voltages, such as chargers, solar and data center power.

Why are analog chips important for supply security?

Analog chips sit in nearly every electronic system, stay in production for many years and are hard to substitute. Defense and industrial customers are qualifying suppliers outside single-country supply chains to reduce risk.

What is zonal architecture in cars?

Zonal architecture groups a vehicle's electronics by physical zone, connected to a few central computers, instead of using dozens of separate control units. It reduces wiring and enables software-defined vehicles.

Why is RISC-V growing?

RISC-V is an open instruction-set architecture that companies can use without licensing fees and customize freely, which appeals to industrial, automotive and regional chipmakers seeking independence.

What makes electronics radiation-hardened?

Radiation-hardened devices use design, materials and processes that tolerate the ionizing radiation found in space and some defense environments without failing or corrupting data.

What are ultrafast lasers used for?

Picosecond and femtosecond lasers remove material with minimal heat, making them ideal for precision cutting, drilling and marking in electronics, medical devices, displays and battery manufacturing.

What do Mobility Foresights semiconductor reports include?

Each linked report provides market size and multi-year forecasts, technology and supply-chain analysis, segmentation by device, application and region, competitive landscape and company profiles, and recent developments. Customization is available on request.

Work With Mobility Foresights

Mobility Foresights provides syndicated and custom research across power, analog, RF, embedded, automotive, space and photonic semiconductors. Each report linked above can be purchased individually or tailored to a specific device, application or region. To request a sample or commission a bespoke study, contact our technology research team.