Global 16nm Chip Market 2024-2030

    In Stock

    GLOBAL 16NM CHIP MARKET

     

    INTRODUCTION

    Following the 20 nm process stopgap, the 16 nanometer (16 nm)  chip lithography process is a full node semiconductor manufacturing process. The production of 16 nm integrated circuits for commercial use started before.

     

    As contrast to gate length or half pitch, the word “16 nm” is merely a commercial designation for a generation of a specific size and associated technology.  The 10 nm technique is expected to take the place of this technology.

     

    GLOBAL 16NM CHIP MARKET SIZE AND FORECAST

     

    Infographics: 16nm Chip Market, 16nm Chip Market Size, 16nm Chip Market Trends, 16nm Chip Market Forecast, 16nm Chip Market Risks, 16nm Chip Market Report, 16nm Chip Market Share

     

    The Global 16nm chip market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

     

    MARKET DYNAMICS

    Due to the rising acceptance of 16nm technology by major clients, Taiwan Semiconductor Manufacturing Company anticipates a 70% increase in its global market share for 16nm chips this year, up from roughly 50% last year. 

     

    TSMC has always insisted on developing a robust internal R&D department. TSMC, a global leader in semiconductor technology, offers the most cutting-edge and comprehensive collection of foundry process technologies. The first foundry to begin risk production of Fin Field Effect Transistor (FinFET) at 16 nanometers was TSMC.

     

    In addition, TSMC became the first foundry to deliver a fully functional 16nm FinFET networking processor to a customer. TSMC introduced the 16nm FinFET Plus (16FF+) process following the success of its 16nm FinFET process. Due to its quick yield ramp and improved performance, 16FF+ entered volume production quickly. 

     

    By incorporating optical shrink and simplifying the process simultaneously, this procedure maximizes die cost scaling. Additionally, 12nm FinFET Compact Technology (12FFC) increases gate density to a level never before seen in production. Among the 16/14nm products in the market, TSMC’s 16/12nm offers the best performance.

     

    16/12nm is 50% faster and uses 60% less power at the same speed than TSMC’s 20nm SoC process. For high-end mobile computing, network communication, consumer electronics, and automotive electronic applications of the next generation, it offers an advantage in terms of performance and power consumption.

     

    Based on TSMC’s industry-leading 28nm technology, 22nm ultra-low power (22ULP) technology was developed and completed all process qualifications in the fourth quarter of 2018. 22ULP reduces area by 10%, increases speed by more than 30%, and reduces power by more than 30% when compared to 28nm high-performance compact (28HPC) technology. These applications include image processing, digital televisions, set-top boxes, smartphones, and consumer goods.

     

    The second EUV process technology that TSMC offers is the N5 technology, which enables customers’ innovations for HPC and smartphone applications. N5 technology is the most advanced solution in the foundry industry and has the best performance, power, and area (PPA).

     

    NEW PRODUCT LAUNCH

    NXP Semiconductors announced the introduction of the S32G2 vehicle network processor and the S32R294 radar processor into serial production using the cutting-edge 16nm chip FinFET process technology from Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).

     

    As cars continue to develop into potent computing platforms, NXP’s S32 family of processors is now transitioning to more sophisticated process nodes. The S32 series of products from NXP continues to be developed with the goal of assisting automakers in streamlining vehicle architecture and producing  fully programmable, networked automobiles.

     

    A variety of data-driven services, including usage-based insurance and vehicle health management, will become available thanks to the S32G2 vehicle networking processors, which enable service-oriented gateways for secure cloud connectivity and over-the-air updates.

     

    In order to support next-generation vehicle architectures, S32G2 processors also function as domain and zonal controllers. They also function as high-performance ASIL D safety processors in systems for enhanced driver assistance and autonomous driving.

     

    S32G2 was able to combine several devices into one by switching to TSMC’s 16nm chip technology, resulting in a potent System-on-Chip (SoC) with a smaller processing footprint.

     

    NXP’s car processors can now take advantage of the power of cutting-edge FinFET transistors for the first time thanks to TSMC’s 16nm technology, which combines enhanced performance with strict automotive process requirements to deliver secure next-generation computing capability.

     

    NXP’s 16nm automotive processors pave the way for a wider migration to TSMC’s 5nm  chip process for the NXP S32 family of car processors thanks to TSMC’s extensive roadmap for automotive processes. Design services for chips with 16nm geometry have been made available by eInfochips.

     

    The Nova processor from Huawei is the first 16nmFinFET-based chip in the world. It functions primarily as a networking processor that can support many bands on a single chip, including GSM, UMTS, LTE FDD, and LTE TDD. It is built using 16FinFET technology and the ARM64 architecture. In addition, Huawei says that it offers improved performance and flexibility while being 67% more efficient than conventional CPUs.

     

    Together, ARM and TSMC announced that tape-out on a Cortex-A57 CPU built on TSMC’s forthcoming 16nm FinFET hybrid technology has been completed.

     

    The release of NXP’s S32G2 vehicle network processors and S32R294 radar processor into volume production on TSMC’s cutting-edge 16 nanometer (nm) FinFET process technology was announced by NXP Semiconductors N.V. and Taiwan Semiconductor Manufacturing Company.

     

    COMPANY PROFILE

     

    THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

    1. How many 16nm Chips are manufactured per annum globally? Who are the sub-component suppliers in different regions?
    2. Cost breakup of a Global 16nm Chip and key vendor selection criteria
    3. Where is the 16nm Chip manufactured? What is the average margin per unit?
    4. Market share of Global 16nm Chip market manufacturers and their upcoming products
    5. Cost advantage for OEMs who manufacture Global 16nm Chip in-house
    6. key predictions for next 5 years in Global 16nm Chip market
    7. Average B-2-B 16nm Chip market price in all segments
    8. Latest trends in 16nm Chip market, by every market segment
    9. The market size (both volume and value) of the 16nm Chip market in 2024-2030 and every year in between?
    10. Production breakup of 16nm Chip market, by suppliers and their OEM relationship
    Sl no Topic
    1 Market Segmentation
    2 Scope of the report
    3 Abbreviations
    4 Research Methodology
    5 Executive Summary
    6 Introduction
    7 Insights from Industry stakeholders
    8 Cost breakdown of Product by sub-components and average profit margin
    9 Disruptive innovation in the Industry
    10 Technology trends in the Industry
    11 Consumer trends in the industry
    12 Recent Production Milestones
    13 Component Manufacturing in US, EU and China
    14 COVID-19 impact on overall market
    15 COVID-19 impact on Production of components
    16 COVID-19 impact on Point of sale
    17 Market Segmentation, Dynamics and Forecast by Geography, 2024-2030
    18 Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030
    19 Market Segmentation, Dynamics and Forecast by Application, 2024-2030
    20 Market Segmentation, Dynamics and Forecast by End use, 2024-2030
    21 Product installation rate by OEM, 2024
    22 Incline/Decline in Average B-2-B selling price in past 5 years
    23 Competition from substitute products
    24 Gross margin and average profitability of suppliers
    25 New product development in past 12 months
    26 M&A in past 12 months
    27 Growth strategy of leading players
    28 Market share of vendors, 2024
    29 Company Profiles
    30 Unmet needs and opportunity for new suppliers
    31 Conclusion
    32 Appendix
     
    0
      0
      Your Cart
      Your cart is emptyReturn to Shop