The Advanced Film Analysis System can be combined with Nanometrics’ spectroscopic reflectivity analysis software, image processing for automated pattern alignment, and a variety of optical configuration choices, making the NanoSpec II automated the most powerful thin film system in its class.
The Global Advanced film analysis system market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The FilmTekTM CD optical critical dimension system is SCI’s cutting-edge solution for fully automated, high-throughput CD measurement and advanced film analysis for the 1x nm design node and beyond.
This technology provides real-time multi-layer stack characterisation as well as CD measurement for both known and unknown architectures.
FilmTekTM CD employs patented multimodal measurement technology to address the demanding needs associated with the most complex semiconductor design features in development and production.
This method permits the measurement of extremely small line widths with excellent precision in the sub-10 nm region.
Existing metrology methods that depend on traditional ellipsometry or reflectometry techniques are limited in their capacity to resolve CD measurements reliably in real-time, necessitating time-consuming library generation during device research and development.
FilmTek CD solves this constraint with a patented multi-modal measurement technology that gives an accurate single answer for even the most unknown shapes.
FilmTek CD features proprietary diffraction software that optimises in real time. Real-time optimization enables the user to measure unknown structures quickly and simply with little setup time and recipe writing while eliminating the delays and complexity associated with library generation.
CD parameter measurement in its entirety, including period, linewidth, trench depth, and sidewall angle.
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