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A form of circuitry called power electronics enables practical usage by effectively, compactly, and reliably transferring power from a source to a load.
This device controls the conversion of electrical power from one form to another by utilizing diodes, transistors, and thyristors. Electric power supply management and conversion are the responsibilities of the power electronics used in electric cars.
Some of the most essential power electronic features and components are used in the electric vehicle system. These consist of inverters, converters, and onboard chargers.
Power electronic devices offer a faster switching rate at greater efficiency, allowing them to be utilized to efficiently carry out activities at high voltage or current. According to demand, power electronics also control the flow of energy in both ways, and the regenerated energy may be sent back to the utility.
The Africa EV Power electronics market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2029, registering a CAGR of XX% from 2024 to 2030.
The HybridPACKTM DC6i, a novel IGBT power module designed specifically for the requirements of electric car traction inverters in the 80 kW to 100 kW power class, is offered by Infineon Technologies AG.
This six-pack module is designed to provide small battery electric and hybrid cars with an outstanding match between system cost and performance. It blends packaging technology with Infineon’s well-known EDT2 IGBTs for compactness, excellent thermal control at lower material costs, and simple installation.
The design of affordable traction inverters is becoming more important due to the global increase in vehicle electrification. The power module that is chosen in this context is crucial; system designers seek the best-sized module with the ideal silicon area for the desired performance.
The HybridPACK DC6i is positioned in Infineon’s portfolio between the HybridPACK1 family and the more potent HybridPACK Drive family.
The new module is 25% smaller than the HybridPACK Drive and has the same modest footprint as the HybridPACK1 (7.2 cm × 14 cm), but its output power is more than 50% greater. The HybridPACK DC6i has the most recent EDT2 IGBTs whereas the HybridPACK1 makes use of Infineon’s IGBT3 technology.
Furthermore, compared to the HybridPACK1 family, the new module features six screw connections to the DC-link capacitor. This makes it possible to create a low-inductive design with a 15 nH stray inductance.
Infineon’s unique direct-cooling wave baseplate, which has a thermal resistance of 0.17 K/W from the IGBT chip junction to the fluid, offers outstanding and reasonably priced heat dissipation.
