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A product called the camera module is used to take pictures and films with mobile devices like smartphones, automobiles, and smart home appliances. High technology is required in all fields, requiring high resolution, miniaturisation, slimming, low-power, and high stiffness.
For multi-gigabit automobile applications, the A-PHY physical layer interface is a long-reach serializer-deserializer. In addition to adding functional safety and security, It is increasingly more common to make it easier for cameras, sensors, and displays to be integrated into automobiles in addition to adding functional safety and security. It has a long reach, high reliability, great resilience, and high performance.
The Global Automotive A-PHY camera module market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
In order to launch MIPI A-PHY-compliant camera systems for the automotive industry, OMNIVISION has entered into a firm agreement with Valens Semiconductor. A-PHY-compliant chipsets from Valens Semiconductor’s VA7000 will be used in OMNIVISION’s Automotive Reference Design Systems (ARDS) camera modules per the agreement. The OXO8B40 image sensor from OMNIVISION will also be part of the initial camera module.
Valens Semiconductor and Leopard Imaging have announced that they have partnered to design a camera module that will enable automotive OEMs and Tier 1s to significantly reduce time to market for their A-PHY-based systems.
In order to provide system-in-package modules for MIPI A-PHY compliant chipsets, Valens Semiconductor and LG Innotek have partnered.
