AUTOMOTIVE HBM MARKET

INTRODUCTION

 High Bandwidth Memory is a high-speed computer memory interface for 3D-stacked synchronous dynamic random-access memory. It is used in conjunction with high-performance network devices, high-performance datacenter AI ASICs, and FPGAs. The first HBM memory chip and HBM-enabled devices were some supercomputers.

Automotive electronics refers to all electronic components that are utilised in cars, such as the radio, car computers, telematics, in-car entertainment systems, and engine control. Trucks, motorbikes, off-road vehicles, and other internal combustion-powered equipment like forklifts, tractors, and excavators also have ignition, engine, and transmission electronics.

Electric and hybrid vehicles both have similar components for controlling pertinent electrical systems. Compared to DDR4 or GDDR5, HBM achieves better bandwidth with lower power consumption in a significantly smaller physical factor. Up to eight DRAM dies and an optional base die, which may have test logic and buffer circuitry, are stacked to achieve this.

The memory controller on a GPU or CPU is frequently connected to the stack using a substrate, such as a silicon interposer. An alternative would be to stack the memory die directly atop the CPU or GPU chip. Through-silicon vias and micro bumps connect the die vertically within the stack.

AUTOMOTIVE HBM MARKET SIZE AND FORECAST

 The Global Automotive HBM market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

NEW PRODUCT LAUNCH IN AUTOMOTIVE HBM MARKET

Infineon launches a brand-new Automotive HBM EV torque transducer. HBM claims that these optimisation tasks can be carried out using the new T12HP precision torque transducer. This series is offered with an accuracy class of 0.02 and a defined maximum permitted speed of up to 22,000rpm.

Due to the excellent basic accuracy of this transducer, a FlexRange function can be used over the entire measuring range of up to 10 kNm. Users can therefore focus on freely selectable measurement ranges rather than having to switch between defined measurement ranges.

For mechanical and electrical quantities, engineers all around the world rely on precise and trustworthy measurement data from sensors, data gathering devices, and software. Test-bench measuring technology has been impacted and will continue to be impacted by the steady shift in mobility ideas from combustion engines to electric motors in the near future.

Electric drive systems have a much higher power density compared to conventional combustion engines because of their smaller size and less weight. Almost 90% of the electric energy in electric motors is transformed into mechanical energy, resulting in a heat loss of only approximately 10%.

Also, electric drives in automobiles operate at noticeably greater rotational speeds, which makes e-mobility test benches a particularly difficult problem for torque measurement technology.

COMPANY PROFILED IN THE AUTOMOTIVE HBM MARKET

• Infineon.
• NXP.
• Renesas Micron Technology, Inc.
• SK Hynix Inc.
• Intel Corp.
• Fujitsu Ltd.

AUTOMOTIVE HBM MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Automotive HBM are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Automotive HBM and key vendor selection criteria
3. Where is the Automotive HBM manufactured? What is the average margin per unit?
4. Market share of Global Automotive HBM market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Automotive HBM in-house
6. key predictions for the next 5 years in the Global Automotive HBM market
7. Average B-2-B Automotive HBM market price in all segments
8. Latest trends in Automotive HBM market, by every market segment
9. The market size (both volume and value) of the Automotive HBM market in 2024-2030 and every year in between?
10. Production breakup of the Automotive HBM market, by suppliers and their OEM relationship