
- Get in Touch with Us
Last Updated: Apr 27, 2025 | Study Period:
SIC stands for silicon carbide semiconductor, and IGBT stands for insulated gate bipolar transistor. In sectors requiring high voltage, high temperature, and high power, SiC IGBT devices exhibit greater competitiveness.
SiC mosfet and SiC gate turn-off thyristor flaws are made up for by the superior static and dynamic performance of SiC IGBTs (GTOs). The SIC IGBT with 4H-polytype and n-channel is chosen among SiC polytypes and channel types because of its low forward voltage, quick switching, and large safe operating region.
The Global Automotive IGBT-SiC module driver market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Infineon EconoDUAL module gate-driver boards from the SCALE EV series have been introduced by Power Integrations. Dual-channel plug-and-play drivers for silicon IGBTs and silicon-carbide (SiC) MOSFETs that are automotive-qualified are available in the SCALE EV family.
With increased characteristics for driving and safeguarding silicon carbide (SiC) MOSFETs as well as functional safety, the GD3160 is an upgraded, cutting-edge single-channel high-voltage isolated gate driver.
It enables users to set the ideal parameters for controlling and safeguarding practically any SiC MOSFET or Si IGBT power switch. It enables users to set the ideal parameters for controlling and safeguarding practically any SiC MOSFET or Si IGBT power switch.
The 35-V, single-channel, output stage power management gate drivers for silicon-carbide (SiC) FETs and insulated-gate bipolar transistors (IGBTs) were released by Texas Instruments Inc.
A novel silicon-carbide (SiC) based hybrid IGBT will be unveiled and displayed by ON Semiconductor.
The AFGHL50T65SQDC offers low conduction and switching losses in numerous power applications, including those that will benefit from reduced reverse recovery losses, such as totem pole based bridgeless power factor correction (PFC) and inverters. It does this by utilising the most recent field stop IGBT and SiC Schottky diode technology.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2024 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2024 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |