Global Automotive MOSFET Market 2023-2030

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    A MOSFET is a type of field-effect transistor, most commonly fabricated by the controlled oxidation of silicon. It has an insulated gate, the voltage of which determines the conductivity of the device. This ability can be used for amplifying or switching electronic signals.

    Infographics-Automotive MOSFET Market , Automotive MOSFET Market Size, Automotive MOSFET Market Trends, Automotive MOSFET Market Forecast, Automotive MOSFET Market Risks, Automotive MOSFET Market Report, Automotive MOSFET Market Share


    The main advantage of a MOSFET is that it requires almost no input current to control the load current, when compared with bipolar transistors (bipolar junction transistors/BJTs). In an enhancement mode MOSFET, voltage applied to the gate terminal increases the conductivity of the device.


    There are thousands to millions of integrated MOSFET transistors on each of the digital integrated circuits used in microprocessors and memory devices, which perform the fundamental switching tasks needed to build logic gates and data storage.


    In applications like switch mode power supplies, variable-frequency drives, and other power electronics, where each device may be switching hundreds of watts, discrete devices are frequently employed.


    MOSFET transistors are used as analogue signal and power amplifiers in radio-frequency amplifiers up to the UHF band, radio systems as mixers or oscillators to change frequencies, in audio-frequency power amplifiers for home and car audio systems, sound reinforcement, and public address systems.




    The Global Automotive MOSFET market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.



    For automotive applications, Infineon provides a large selection of power MOSFETs that include N-Channel, P-Channel, and Dual-channel MOSFETS. The number of MOSFET-related failures is kept to an absolute minimum by engineers and automakers employing high-quality components, such as automotive power MOSFETs from Infineon.


    Infineon offers a broad selection of automotive MOSFETs that are created with the experience of many decades, together with sensors, microcontrollers, and other necessary semiconductor solutions. 


    The LF Dual Series MOSFET has been introduced by Shindengen Electric Manufacturing Co., Ltd. for several vehicle ECU types. This series helps reduce the number of components in a variety of applications, such as automotive motor drive, engine ECU (injector drive), reverse connection and reverse current prevention relays, and more.


    It does this by maintaining the low dissipation and large current characteristics of Shindengen’s conventional products while incorporating two elements into a single package.


    To lessen the conduction loss of automobile BLDC motors, Magnachip has created a new 40V MOSFET with low RDS(on), and the business has started mass producing this new MOSFET. The new 40V MOSFET is fully AEC-Q101 (Automotive Electronics Council-Q101) approved, which is important since reliable automotive semiconductors are essential to vehicle safety.


    Toshiba Launches Automotive 40V N-Channel Power MOSFETs with New Package that Contributes to High Heat Dissipation and Size Reduction of Automotive Equipment. Toshiba Electronic Devices & Storage Corporation has introduced two automotive 40V N-channel power MOSFETs, the “XPJR6604PB” and “XPJ1R004PB,” that employ Toshiba’s innovative S-TOGL (Small Transistor Outline Gull-wing Leads) container and U-MOS IX-H process chips. 


    Safety-critical applications, such as autonomous driving systems, assure reliability through redundant design, requiring more devices and mounting space than normal systems. As a result, progressive size reductions in automotive equipment necessitates power MOSFETs with high current densities.


    Toshiba’s innovative S-TOGL package, which has a post-less construction that unifies the source connective component and outer leads, is used in the XPJR6604PB and XPJ1R004PB. The use of a multi-pin arrangement for the source leads reduces package resistance.


    In comparison to Toshiba’s TO-220SM (W) package product, which has the same thermal resistance properties, the S-TOGL package with Toshiba’s U-MOS IX-H process significantly reduce On-resistance by 11%. Comparing the new package to the TO-220SM(W) package, the necessary mounting area is reduced by about 55%.


    Additionally, the new package’s 200A drain current rating is higher than Toshiba’s equivalent-sized DPAK + package, allowing for high current flow. S-TOGL realises high-density and compact layouts, shrinks the size of automotive equipment, and increases heat dissipation overall.


    Additionally, the new package’s 200A drain current rating is higher than Toshiba’s equivalent-sized DPAK + package, allowing for high current flow. S-TOGL realises high-density and compact layouts, shrinks the size of automotive equipment, and increases heat dissipation overall.


    Since automotive equipment is utilised in high-temperature situations, the dependability of surface-mount solder junctions is essential. The S-TOGL package incorporates gull-wing leads, which reduce mounting stress and improve solder union durability.


    Toshiba supports grouping shipment for the new products, assuming that many devices will be linked in parallel for applications needing greater current operation.This enables the use of product groupings with minor change in characteristics in designs.



    1. How many Automotive MOSFETs are manufactured per annum globally? Who are the sub-component suppliers in different regions?
    2. Cost breakup of a Global Automotive MOSFET and key vendor selection criteria
    3. Where is the Automotive MOSFET manufactured? What is the average margin per unit?
    4. Market share of Global Automotive MOSFET market manufacturers and their upcoming products
    5. Cost advantage for OEMs who manufacture Global Automotive MOSFET in-house
    6. key predictions for next 5 years in Global Automotive MOSFET market
    7. Average B-2-B Automotive MOSFET market price in all segments
    8. Latest trends in Automotive MOSFET market, by every market segment
    9. The market size (both volume and value) of the Automotive MOSFET market in 2023-2030 and every year in between?
    10. Production breakup of Automotive MOSFET market, by suppliers and their OEM relationship
    Sl no Topic
    1 Market Segmentation
    2 Scope of the report
    3 Abbreviations
    4 Research Methodology
    5 Executive Summary
    6 Introduction
    7 Insights from Industry stakeholders
    8 Cost breakdown of Product by sub-components and average profit margin
    9 Disruptive innovation in the Industry
    10 Technology trends in the Industry
    11 Consumer trends in the industry
    12 Recent Production Milestones
    13 Component Manufacturing in US, EU and China
    14 COVID-19 impact on overall market
    15 COVID-19 impact on Production of components
    16 COVID-19 impact on Point of sale
    17 Market Segmentation, Dynamics and Forecast by Geography, 2023-2030
    18 Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030
    19 Market Segmentation, Dynamics and Forecast by Application, 2023-2030
    20 Market Segmentation, Dynamics and Forecast by End use, 2023-2030
    21 Product installation rate by OEM, 2023
    22 Incline/Decline in Average B-2-B selling price in past 5 years
    23 Competition from substitute products
    24 Gross margin and average profitability of suppliers
    25 New product development in past 12 months
    26 M&A in past 12 months
    27 Growth strategy of leading players
    28 Market share of vendors, 2023
    29 Company Profiles
    30 Unmet needs and opportunity for new suppliers
    31 Conclusion
    32 Appendix
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