GLOBAL AUTOMOTIVE ULTRA-HDI PCB MARKET

INTRODUCTION

 Printed circuit boards with high-density interconnect, or HDI, have more wiring per unit space than conventional printed circuit boards. Microvias, blind and buried vias, built-up laminations, and high signal performance considerations are generally considered to be HDI PCBs. The development of printed circuit boards has kept pace with the need for smaller and faster products as technology has changed. 

The vias, pads, copper traces, and gaps on HDI boards are all smaller. Since HDIs have denser wiring, their PCBs are smaller, lighter, and have fewer layers. One HDI board can replace the functionality of several PCBs that were previously used in a device.

GLOBAL AUTOMOTIVE ULTRA-HDI PCB MARKET SIZE AND FORECAST

The Global Automotive ultra-HDI PCB market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.

RECENT DEVELOPMENT

Ultra HDI PCBs put high demands on technology and manufacturing. A strong tendency toward miniaturisation may be seen in the electronics industry. As components become smaller and smaller, new requirements are placed on the design of the PCBs that they are installed on. NCAB Group is fully dedicated to IPC's efforts to create standards for extremely dense Ultra HDI PCBs and will be able to provide clients with these products as a result.

NCAB receives requests on a daily basis about printed circuit boards with smaller conductor widths and isolation distances than normal HDI boards.

The extremely downsized new components have been employed, among other things, in 5G telecommunications technology, sensors, and high-end smartphones from major manufacturers.

We are now seeing the technology spread to other sectors of the industry. NCAB receives requests on a daily basis about printed circuit boards with smaller conductor widths and isolation distances than normal HDI boards. Medical technology and the automotive sector are two examples of applications.

The pattern must be able to be transferred on the board with a resolution that is high enough to accommodate the increasing level of miniaturisation. The factory must own state-of-the-art so-called LDI equipment (Laser Direct Imaging).

To eliminate contamination and dust, the surroundings must also be exceedingly clean, which requires a substantial expenditure. To identify and prevent any board flaws, testing procedures and automated optical inspection (AOI) tools must be updated. When copper plating, you must also consider the machinery and chemistry. Additionally, the requirement for cleaner and more uniform materials will result from miniaturisation.

COMPANY PROFILE

• Delphi Automotive
• Samsung Electro-Mechanics
• Meiko Electronics
• Unimicron Technology
• Nippon Mektron

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Automotive ultra-HDI PCBs are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a  Global Automotive ultra-HDI PCB and key vendor selection criteria
3. Where is the Automotive ultra-HDI PCB manufactured? What is the average margin per unit?
4. Market share of Global Automotive ultra-HDI PCB market  manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Automotive ultra-HDI PCB in-house
6. key predictions for next 5 years in Global Automotive ultra-HDI PCB market
7. Average B-2-B Automotive ultra-HDI PCB market price in all segments
8. Latest trends in Automotive ultra-HDI PCB market, by every market segment
9. The market size (both volume and value) of the Automotive ultra-HDI PCB market in 2022-2030 and every year in between?
10. Production breakup of Automotive ultra-HDI PCB market, by suppliers and their OEM relationship