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Last Updated: Apr 25, 2025 | Study Period: 2023-2030
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.
A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds
A BGA substrate cutting machine is a machine that cuts all kinds of shapes and creations from materials. This makes a cutting job easier and faster for you. The most familiar models for DIYers are the ones by BGA substrate.
The Global BGA substrate cutting machine market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
SSC 165A BGA SUBSTRATE CUTTING MACHINE
Substrate cutting made easy, by Americaâs leader in vertical cutting. Cut the essential sign making materials including and not limited to PVC, foam board, MDF, acrylic, magnetic sheet, and corrugated plastic.
This machine features 65â³ maximum crosscut, whilethe 210A featuresan 82â³ maximum crosscut, and the250A features a 98â³ maximum crosscut. There are no other differences between our substrate cutters.
These units are designed to cut cleanly and accurately without dust and noise. The interchangeable tool cartridges that can be changed in under 10 seconds means that the user only buy the tools need. The cartridge system allows new tools to be developed for new materials giving the SSC 165A virtually unlimited scalability.
It comes along with Single blade cartridge cutting up to (20mm/.75in) ; Three blade utility cartridge cutting up to 13mm/.5in ; ACM Cutting Wheel cartridge ; Acrylic scoring cartridge ; Wall Mounting Kit ; Clamping System ; Two Production Stops ; Integrated Laser Sight Line ; Integral Counter Weight ; Two Upper Frame Quickstops
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introdauction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in theIndustry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2023-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2023-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2023-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |