By submitting this form, you are agreeing to the Terms of Use and Privacy Policy.
Coming Soon
Due to its low production costs, simplicity in producing large-area goods, flexibility, and light weight for wearable device integration, flexible organic light-emitting diodes (OLEDs) have drawn a lot of attention.
However, OLEDs’ organic components and low work function metallic cathodes are extremely vulnerable to ambient moisture and oxygen.
By oxidising the as-deposited electrodes or corroding the functional organic layers, water and oxygen infiltrate through plastic substrates to generate dark spots and edge shrinkages in OLEDs, degrading the devices and shortening their lifetime.
As a result, encapsulation technologies are essential to extending the life and increasing the dependability of OLEDs. Thin film coating, metal covers, glass, and the sealing of electronics between two glass substrates or plastic substrates treated with barrier films are just a few of the encapsulation techniques that have been developed.
Due to its low weight, transparency, and high level of mechanical flexibility, thin film encapsulation (TFE) is regarded as the most promising technique among the different potential counterparties.
The Global Black matrix (BM) encapsulant film Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The development of thin-film encapsulation has the most promise due to the barrier performance of inorganic film.It is difficult to avoid pinhole and cracking faults in the inorganic layer surface, nevertheless.
Additionally, a thicker inorganic coating increases the chance that it will crack when bent, reducing the mechanical flexibility of the encapsulation. The most common encapsulation method for flexible electronics at the moment is Vitex barrier technology, which alternates inorganic and organic layer pairings.
Improved flexibility under mechanical deformation results from sandwiching an organic layer between two inorganic ones.
Additionally, the organic components have the capacity to decouple faults in the inorganic layers, which results in a very long effective diffusion length and decreased total permeability by creating a tortuous path to avoid pinholes and cracks that penetrate through the entire encapsulation.
