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When connecting low- to medium-speed devices wirelessly without the use of short-range cables and wires, Bluetooth is a cost-effective solution. A device with Bluetooth connectivity has Bluetooth chips within.
Information from a sender device is received by a Bluetooth chip, which then sends it over a unique short-range radio frequency to a receiver. A PCBA board with an integrated Bluetooth feature serves as the Bluetooth chip.
Based on their respective functions, they are divided into two modules: Bluetooth data module and the Bluetooth voice module. Classic Bluetooth chips, Bluetooth Low Energy (BLE), and Dual-mode Bluetooth chips are the three different categories of Bluetooth chips.
They are utilised in a number of devices, including wearable technology, wireless speakers and headsets, and mobile phones.
The Global Bluetooth chips market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
The MT7650, an 802.11ac plus Bluetooth 4.0+HS combination chip created for mobile consumer platforms, has been made available by MediaTek Inc. The MediaTek MT7650 integrates Bluetooth 4.0 LE and the most recent IEEE 802.11ac technologies.
A pair of new Bluetooth systems-on-a-chip (SoC), designated QCC514X and QCC304X series, have been unveiled by Qualcomm and will be included in its truly wireless earbuds.
The goal of both Bluetooth chipsets is to upgrade Bluetooth headphones with more premium capabilities like voice assistant compatibility and noise cancellation. Qualcomm’s TrueWireless Mirroring technology will be supported by both chipsets.
With out-of-the-box compatibility for Wi-Fi 6, Bluetooth LE 5.2, and 802.15.4 (also known as Thread) at the same time, NXP’s new tri-radio SoC is intended to be the magic bullet for complete smart home connectivity in a single chip. While some lightbulbs use Thread or Zigbee, others use Wi-Fi or Bluetooth.
This is where NXP’s IW612 SoC comes in; it will make it easier for forthcoming Matter hub devices to communicate with a variety of smart home devices, both new and old, which (at least in theory) will help the new standard better integrate with consumers’ settings.
The most recent Bluetooth Low Energy Audio Qualification Process was successfully completed by the new line of Bluetooth audio chips from Airoha Technology.
A variety of applications, including True Wireless Stereo (TWS) earbuds, Bluetooth smart speakers, assistive listening devices, and Bluetooth transmitters, are supported by the “flagship” and “professional” series of chipsets. The LE Audio specifications mark the greatest significant accomplishment in the Bluetooth audio sector in the previous ten years.
The world’s most cutting-edge, integrated System-on-Chip (SoC) family for wireless connectivity, the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, was unveiled by Renesas Electronics Corporation.
The DA1470x Family is the only product in the Bluetooth LE market that combines Bluetooth LE connectivity, a power management unit, a hardware voice activity detector (VAD), and a graphics processing unit (GPU) into a single chip.
The most cutting-edge sensor and graphics capabilities as well as seamless, ultra-low-power, always-on audio processing are all provided by this unified functionality for smart IoT devices.
The new family is perfect for Bluetooth-enabled Bluetooth consoles like e-bikes and gaming gear as well as wearables like smartwatches and fitness trackers, glucose monitor readers, and other consumer medical and healthcare products.
