Global Bluetooth Chips Market 2024-2030

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    BLUETOOTH CHIPS MARKET

     

    INTRODUCTION TO BLUETOOTH CHIPS MARKET

     When connecting low- to medium-speed devices wirelessly without the use of short-range cables and wires, Bluetooth is a cost-effective solution. A device with Bluetooth connectivity has Bluetooth chips within.

     

    Information from a sender device is received by a Bluetooth chip, which then sends it over a unique short-range radio frequency to a receiver. A PCBA board with an integrated Bluetooth feature serves as the Bluetooth chip.

     

    Global Bluetooth Chips Market 2022-2030

     

    Based on their respective functions, they are divided into two modules: the Bluetooth data module and the Bluetooth voice module. Classic Bluetooth chips, Bluetooth Low Energy (BLE), and Dual-mode Bluetooth chips are the three different categories of Bluetooth chips.

     

    They are utilised in a number of devices, including wearable technology, wireless speakers and headsets, and mobile phones.

     

    BLUETOOTH CHIPS MARKET SIZE AND FORECAST

     

    The Global Bluetooth chips market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

     

    BLUETOOTH CHIPS MARKET RECENT PRODUCT DEVELOPMENT AND INNOVATION

    The MT7650, an 802.11ac plus Bluetooth 4.0+HS combination chip created for mobile consumer platforms, has been made available by MediaTek Inc. The MediaTek MT7650 integrates Bluetooth 4.0 LE and the most recent IEEE 802.11ac technologies.

     

    A pair of new Bluetooth systems-on-a-chip (SoC), designated QCC514X and QCC304X series, have been unveiled by Qualcomm and will be included in its truly wireless earbuds.

     

    The goal of both Bluetooth chipsets is to upgrade Bluetooth headphones with more premium capabilities like voice assistant compatibility and noise cancellation. Qualcomm’s TrueWireless Mirroring technology will be supported by both chipsets.

     

    With out-of-the-box compatibility for Wi-Fi 6, Bluetooth LE 5.2, and 802.15.4 (also known as Thread) at the same time, NXP’s new tri-radio SoC is intended to be the magic bullet for complete smart home connectivity in a single chip. While some lightbulbs use Thread or Zigbee, others use Wi-Fi or Bluetooth.

     

    This is where NXP’s IW612 SoC comes in; it will make it easier for forthcoming Matter hub devices to communicate with a variety of smart home devices, both new and old, which (at least in theory) will help the new standard better integrate with consumers’ settings.

     

    The most recent Bluetooth Low Energy Audio Qualification Process was successfully completed by the new line of Bluetooth audio chips from Airoha Technology.

     

    A variety of applications, including True Wireless Stereo (TWS) earbuds, Bluetooth smart speakers, assistive listening devices, and Bluetooth transmitters, are supported by the “flagship” and “professional” series of chipsets. The LE Audio specifications mark the greatest significant accomplishment in the Bluetooth audio sector in the previous ten years.

     

    The world’s most cutting-edge, integrated System-on-Chip (SoC) family for wireless connectivity, the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, was unveiled by Renesas Electronics Corporation.

     

    The DA1470x Family is the only product in the Bluetooth LE market that combines Bluetooth LE connectivity, a power management unit, a hardware voice activity detector (VAD), and a graphics processing unit (GPU) into a single chip.

     

    The most cutting-edge sensor and graphics capabilities as well as seamless, ultra-low-power, always-on audio processing are all provided by this unified functionality for smart IoT devices.

     

    The new family is perfect for Bluetooth-enabled Bluetooth consoles like e-bikes and gaming gear as well as wearables like smartwatches and fitness trackers, glucose monitor readers, and other consumer medical and healthcare products.

     

    BLUETOOTH CHIPS MARKET COMPANY PROFILE

     

    THIS REPORT WILL ANSWER THE FOLLOWING QUESTIONS ABOUT BLUETOOTH CHIPS MARKET

    1. What is the average cost per Global Bluetooth chips market right now and how will it change in the next 5-6 years?
    2. Average cost to set up a Bluetooth chips market in the US, Europe, and China?
    3. How many Bluetooth chips market are manufactured per annum globally? Who are the sub-component suppliers in different regions?
    4. What is happening in the overall public, globally?
    5. Cost breakup of a Bluetooth chips market and key vendor selection criteria
    6. Where is the Bluetooth chips market manufactured? What is the average margin per equipment?
    7. Market share of Bluetooth chip manufacturers and their upcoming products
    8. The most important planned Global Bluetooth chips market in the next 2 years
    9. Details on a network of major Global Bluetooth chip markets and pricing plans
    10. Cost advantage for OEMs who manufacture Bluetooth chips in-house
    11. 5 key predictions for the next 5 years in the Bluetooth chips industry
    12. Average B-2-B Global Bluetooth chips market price in all segments
    13. Latest trends in Global Bluetooth chips market, by every market segment
    14. The market size (both volume and value) of the Bluetooth chips in 2024-2030 and every year in between?
    15. Global production breakup of the Global Bluetooth chips market, by suppliers and their OEM relationship
    Sl no Topic
    1 Market Segmentation
    2 Scope of the report
    3 Abbreviations
    4 Research Methodology
    5 Executive Summary
    6 Introduction
    7 Insights from Industry stakeholders
    8 Cost breakdown of Product by sub-components and average profit margin
    9 Disruptive innovation in the Industry
    10 Technology trends in the Industry
    11 Consumer trends in the industry
    12 Recent Production Milestones
    13 Component Manufacturing in US, EU and China
    14 COVID-19 impact on overall market
    15 COVID-19 impact on Production of components
    16 COVID-19 impact on Point of sale
    17 Market Segmentation, Dynamics and Forecast by Geography, 2024-2030
    18 Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030
    19 Market Segmentation, Dynamics and Forecast by Application, 2024-2030
    20 Market Segmentation, Dynamics and Forecast by End use, 2024-2030
    21 Product installation rate by OEM, 2023
    22 Incline/Decline in Average B-2-B selling price in past 5 years
    23 Competition from substitute products
    24 Gross margin and average profitability of suppliers
    25 New product development in past 12 months
    26 M&A in past 12 months
    27 Growth strategy of leading players
    28 Market share of vendors, 2023
    29 Company Profiles
    30 Unmet needs and opportunity for new suppliers
    31 Conclusion
    32 Appendix
                 
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