Chip-On-Glass (COG) is a flip chip bonding technique that uses anisotropic conductive film to directly link bare integrated circuits (ICs) on glass substrates (ACF). Display controllers for Chip-on-Glass (COG) OLED Display Modules are etched into the glass as opposed to being on a PCB.
This Chip-On-Glass technology reduces the assembly area to the greatest packing density feasible, which is especially important for space-saving applications.
It enables cost-effective driver chip attachment because flex PCB integration is no longer required. The integrated circuit is attached directly to the glass substrate and can handle high-speed or high-frequency signals.
The Global Chip On Glass Character OLEDs market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Display controllers on Vishay Chip-on-Glass (COG) OLED Display Modules are engraved into the glass as opposed to being on a PCB.
This architecture allows per-pixel control of the display buffer and does away with the requirement for external graphics controllers. These display modules come in both character and graphic formats.
Text and small icons are typically displayed on COG OLED Display Modules, which are composed of arrays of pixel grids.
A single, sizable pixel grid makes up the visual COG OLED Display Modules. Although they can show text, they excel at doing so with images.
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