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Conductive adhesives are ideal for mounting temperature-sensitive chips on smart cards because their curing temperatures are significantly lower than soldering temperatures. Furthermore, these adhesives are significantly more flexible than solder and can tolerate bending of the smart card.
Die attach adhesives are used to secure semiconductor chips to packaging substrates. In addition to making the attachment, they can help reduce stress and minimise warpage during system operation. Some die attach adhesives are designed to be both thermally conductive and electrically insulating.
The Global Conductive Die Attach Pastes market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Henkel has created a broad range of die attach pastes for various wirebond requirements, including smaller die-to-pad ratios, thinner bond lines, low stress to high temperature capability, and robust adhesion. These pastes address the needs for both laminate and leadframe wirebond packages.
Die attach pastes are another popular remedy for issues with lead-free soldering. Henkel’s LOCTITE ABLESTIK portfolio offers exceptional die packaging reliability performance as the market share leader and top innovator of the most cutting-edge die attach solutions.
Today’s high-density laminate packages require conductive die attach paste formulations that are reliable and effective, and LOCTITE ABLESTIK offers a variety of these.
Henkel has created a line of products that are tailored to the specific requirements of laminate-based devices because each package type, including BGAs, LGAs, and Smart Cards, has different requirements.
Henkel offers Bismaleimide (BMI) formulations for low moisture absorption to prevent package cracking during high temperature processing in addition to low modulus conductive die attach pastes for stress reduction and warpage elimination.
