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Data Center laser Interconnect (DCI) means it uses high-speed packet-optical communication to connect two or more data centers over brief, medium-term, or long-term distances.
Applications, data, and content are stored and processed in data centers.
The global data center laser connector market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
As part of a complex agreement, Nokia will offer its data center switching solutions to Microsoft’s data center facilities to enable the bandwidth expansion to Microsoft Azure.
The agreement strengthens the firms’ established partnership, which they have been fostering in order to offer massively scalable, agile, and highly resilient networking to the data center setting.
Nokia has been chosen to provide its 7250 IXR chassis-based interconnect routers to enable high-density 400GE applications in Microsoft’s “tier-2” network architecture due to the considerable expansion of cloud services, cloud computing, and the shift to 400GE.
Other Microsoft network applications will also receive fixed-form-factor platforms from Nokia.The scalability, openness, aggregation, and interconnection needed for contemporary data center networks are provided by Nokia’s next-generation data center switching portfolio platforms.
For data center top of rack (TOR), leaf, spine, and super-spine applications, the 7250 IXR provides a wide choice of high-performance fixed-form-factor and chassis-based alternatives. The platforms enable full IP and Ethernet feature sets, as well as port speeds of up to 400GE with a path to 800GE
CPO data center laser connection system .Molex has unveiled a pluggable module for external laser sources with a cage and blind-mating hybrid optical-electrical connector for hyperscale data centers ready for “co-packaged optics” (CPO).
Molex MX080 optical preparing for “co-packaged optics” (CPO) Molex has announced a pluggable module for external laser sources, with a cage and blind-mating hybrid optical-electrical connector. This module is intended for use in hyperscale data centres.
By relocating optical connections from the front panel to a more central location inside the host system, close to the high-bandwidth networking processors, GPUs, and AI engines, CPO shortens electrical connections.Moving the laser outside removes one source of heat, according to Molex.
Additionally, the design does not include high-speed electrical I/O drivers on the IC or in pluggable modules, which further reduces thermal loads and power consumption within the system.
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