Die-attach, often referred to as die bonding, is a technique for attaching a semiconductor die to a substrate, container, or another die.
Die-attach materials are the substances used in this procedure. Different types of packing depend on this procedure. Due to the increased need for consumer electronics, the usage of electrical circuit boards is expected to increase, driving the global market.
Additionally, the use of numerous electronic components, including die attach materials, is being fueled by the increasing electrification of many sectors throughout the world.
The growing need for adhesive in several applications, the expanding use of die-attach films in packaging, rising disposable income levels, and worldwide urbanisation are further factors that are expected to drive up demand for die attach materials.
The increasing use of die attach materials in LED assemblies is anticipated to benefit the industry as well. Die attach materials are predicted to be in high demand due to the need to evaluate the performance and reliability of LEDs.
The Global Die Attach Adhesive market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
New Die Attach Adhesive for Semiconductor and Surface Mount Technology Applications.DELO has unveiled a new die attach adhesive to replace the DELO MONOPOX MK096.
DELO MONOPOX EG2596 retains its high strength even after age and can be disposed of with greater precision than its predecessor. This has been demonstrated in tests conducted in collaboration with the machine integrator ASM Assembly Systems. The fluorescent glue is appropriate for long-term use in a variety of applications.
The thixotropic qualities of DELO MONOPOX EG2596 allow the adhesive to be dispensed very finely in a low-viscous state due to shear in the dispensing valve. After dispensing, the viscosity increases in fractions of a second, preventing the glue from flowing.
This permits the die attach to be built up in individual droplets and subsequently shaped in a controlled manner, without the adhesive spreading into areas that should remain adhesive-free. Even when heated, the sticky drop stays dimensionally stable.
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