By submitting this form, you are agreeing to the Terms of Use and Privacy Policy.
Coming Soon.
The phrase “field-programmable” refers to an integrated circuit that can be altered by a client or a designer after it has been manufactured. A hardware description language, similar to that used for an application-specific integrated circuit, is typically used to specify the FPGA configuration.
Before, the configuration was specified using circuit diagrams, but with the development of electrical design automation tools, this is becoming less common. Blocks can be connected to one another using the hierarchy of reconfigurable interconnects found in FPGAs, which have a variety of programmable logic blocks.
Logic blocks can be programmed to carry out intricate combinational operations or behave as straightforward logic gates like AND and XOR. Most FPGA logic blocks also have memory components, which might be straightforward flip-flops or larger memory blocks.
It is possible to reprogramme several FPGAs to implement various logic functions, enabling flexible reconfigurable computing like that found in software.
Due to their ability to begin system software development concurrently with hardware, enable system performance simulations at a very early stage of the development, and permit various system trials and design iterations before finalising the system architecture, FPGAs have a remarkable role in embedded system development.
The Global Electric vehicle FPGA market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The Agilex 7 FPGAs with F-Tile in EV, which Intel launched, are believed to have the fastest FPGA transceivers currently available. The FPGAs produce up to 116 gigabits per second and fortified 400 gigabit Ethernet intellectual property and are designed to meet bandwidth-intensive settings like data centres and high-speed networks.
Agilex 7 with F-Tile, which is based on Intel’s 10 nm SuperFin process technology, enables the development of unique chip designs for particular purposes. According to Intel, the chips’ data speeds and multiprotocol capabilities enable users to implement novel connectivity topologies in a single device.
Agilex 7 with F-Tile supports applications such as 25/50G passive optical network for high-speed broadband applications or broadcast standards like HDMI and SDI, as well as 400 Gbps to 1.6 Tbps optical networking applications.