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For leadframe and laminate wirebond packages, electrically conductive die attach pastes meet numerous application-specific processing and performance requirements.
Today’s high-density laminate packages require a wide range of electrically conductive die attach paste formulations to meet their requirements for dependability and performance.
For stress reduction and warpage elimination, electrically conductive die attach pastes feature a low modulus and Bismaleimide (BMI) formulations with low moisture absorption to prevent package cracking during high temperature processing.
Die attach pastes provide high thermal conductivity and high reliability when incorporated into applications like automotive electronics, where temperature control and consistent function are essential.
Die attach materials are the products of choice for specialists in leadframe packaging due to their strong adhesion to a variety of metal surfaces, such as palladium, copper, silver, gold, and PPF, as well as their tried-and-true low-bleed formulations.
The Global Electrically Conductive Die Attach Paste market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Henkel has reported the send off of a high warm bite the dust join glue, called Loctite Ablestik ABP 8068TD, created for use in applications where no pass on posterior metallization (BSM) is required.
According to the company, the material’s adaptability provides semiconductor companies with a die attach option with high thermal conductivity for bare silicon (Si) die integration and is particularly suitable for high power applications.
This material allows packaging specialists to satisfy the requirement for high heat dissipation in applications where bare silicon die are used, particularly in situations where back-side metallization processes are cost- or process-prohibitive.
“OSATs and power device developers have more design and manufacturing options because the material is compatible with various die, metallized or not.
The advantages of semi-sintering are now available to a wider range of power packages with various lead frame finishes thanks to the new die attach paste.The material was tested using bare Si and Ag-metallized dies of varying dimensions, up to 5.0 mm x 5.0 mm, and its bulk thermal conductivity was determined to be 50 W/m-K.
