GLOBAL ELECTRICALLY CONDUCTIVE DIE ATTACH PASTE MARKET

INTRODUCTION

 For leadframe and laminate wirebond packages, electrically conductive die attach pastes meet numerous application-specific processing and performance requirements.

 

Today’s high-density laminate packages require a wide range of electrically conductive die attach paste formulations to meet their requirements for dependability and performance.

 

For stress reduction and warpage elimination, electrically conductive die attach pastes feature a low modulus and Bismaleimide (BMI) formulations with low moisture absorption to prevent package cracking during high temperature processing.

 

Die attach pastes provide high thermal conductivity and high reliability when incorporated into applications like automotive electronics, where temperature control and consistent function are essential.

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Die attach materials are the products of choice for specialists in leadframe packaging due to their strong adhesion to a variety of metal surfaces, such as palladium, copper, silver, gold, and PPF, as well as their tried-and-true low-bleed formulations.

 

GLOBAL ELECTRICALLY CONDUCTIVE DIE ATTACH PASTE MARKET SIZE AND FORECAST

 

The Global Electrically Conductive Die Attach Paste market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.

 

NEW PRODUCT LAUNCH

Henkel has reported the send off of a high warm bite the dust join glue, called Loctite Ablestik ABP 8068TD, created for use in applications where no pass on posterior metallization (BSM) is required.

 

According to the company, the material’s adaptability provides semiconductor companies with a die attach option with high thermal conductivity for bare silicon (Si) die integration and is particularly suitable for high power applications.

 

This material allows packaging specialists to satisfy the requirement for high heat dissipation in applications where bare silicon die are used, particularly in situations where back-side metallization processes are cost- or process-prohibitive.

 

“OSATs and power device developers have more design and manufacturing options because the material is compatible with various die, metallized or not.

 

The advantages of semi-sintering are now available to a wider range of power packages with various lead frame finishes thanks to the new die attach paste.The material was tested using bare Si and Ag-metallized dies of varying dimensions, up to 5.0 mm x 5.0 mm, and its bulk thermal conductivity was determined to be 50 W/m-K.

 

COMPANY PROFILE

  • SMIC
  • Heraeu
  • Henkel
  • Alpha Assembly Solutions
  • Tongfang Tech
  • Shenmao Technology
  • AIM, Indium
  • Shenzhen Weite New Material
  • Sumitomo Bakelite
  • NAMICS
  • Dow
  • Tamura, Palomar Technologies
  • Hitachi Chemical
  • Shanghai Jinji
  • Asahi Solder
  • Inkron
  • Nordson EFD
  • Kyocera

 

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

  1. What is the average cost per Global Electrically Conductive Die Attach Paste marketright now and how will it change in the next 5-6 years?
  2. Average cost to set up a Global Electrically Conductive Die Attach Paste market in the US, Europe and China?
  3. How many Global Electrically Conductive Die Attach Paste market are manufactured per annum globally? Who are the sub-component suppliers in different regions?
  4. What is happening in the overall public, globally?
  5. Cost breakup of a Global Electrically Conductive Die Attach Paste market and key vendor selection criteria
  6. Where is the Global Electrically Conductive Die Attach Paste market manufactured? What is the average margin per equipment?
  7. Market share of Global Electrically Conductive Die Attach Paste market manufacturers and their upcoming products
  8. The most important planned Global Electrically Conductive Die Attach Paste market in next 2 years
  9. Details on network of major Global Electrically Conductive Die Attach Paste market and pricing plans
  10. Cost advantage for OEMs who manufacture Global Electrically Conductive Die Attach Paste marketing-house
  11. 5 key predictions for next 5 years in Title Name
  12. Average B-2-B Global Electrically Conductive Die Attach Paste market price in all segments
  13. Latest trends in Title Name, by every market segment
  14. The market size (both volume and value) of Global Electrically Conductive Die Attach Paste marketing 2022-2030 and every year in between?
  15. Global production breakup of Title Name, by suppliers and their OEM relationship

 

Sl no Topic
1 Market Segmentation
2 Scope of the report
3 Abbreviations
4 Research Methodology
5 Executive Summary
6 Introduction
7 Insights from Industry stakeholders
8 Cost breakdown of Product by sub-components and average profit margin
9 Disruptive innovation in the Industry
10 Technology trends in the Industry
11 Consumer trends in the industry
12 Recent Production Milestones
13 Component Manufacturing in US, EU and China
14 COVID-19 impact on overall market
15 COVID-19 impact on Production of components
16 COVID-19 impact on Point of sale
17 Market Segmentation, Dynamics and Forecast by Geography, 2022-2030
18 Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030
19 Market Segmentation, Dynamics and Forecast by Application, 2022-2030
20 Market Segmentation, Dynamics and Forecast by End use, 2022-2030
21 Product installation rate by OEM, 2022
22 Incline/Decline in Average B-2-B selling price in past 5 years
23 Competition from substitute products
24 Gross margin and average profitability of suppliers
25 New product development in past 12 months
26 M&A in past 12 months
27 Growth strategy of leading players
28 Market share of vendors, 2022
29 Company Profiles
30 Unmet needs and opportunity for new suppliers
31 Conclusion
32 Appendix
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