By submitting this form, you are agreeing to the Terms of Use and Privacy Policy.
Coming Soon
Epoxy adhesives that conduct electricity are most frequently used in electronics applications, where parts need to be kept in place so that electricity can pass between them.
Depending on the distance between components, the majority of conventional adhesives, including anaerobics, cyanoacrylates, epoxies, and acrylic-based adhesives, operate as an electrical insulator.
By channelling heat away from delicate parts, some offer improved thermal conductivity to help with the thermal management of electronic components and heat sinks.
A small amount of electrical charge can still be transferred since there is adequate metal to metal contact even when there isn’t glue line control, especially when using anaerobic or cyanoacrylate adhesive when the parts are effectively contacting.
Temperature-sensitive electronic components cannot be soldered because the strong heat of the soldering iron and liquid solder could harm the component. Instead of solder, an electrically conductive glue must be used for this kind of application.
On a PCB with components mounted on both sides, using an electrically conductive glue facilitates assembly and prevents the chance of components slipping off the underside while parts are soldered on top. Solder re-flow is not required when using electrically conductive adhesive for an entire electrical assembly.
The Global Electrically Conductive Epoxy Adhesives market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
A room-temperature curing electrically conductive adhesive (ECA) has been introduced by adhesives manufacturer Henkel. According to the manufacturer, the new product raises yield rates and safeguards delicate structures in mobile device compact camera modules.
Loctite Ablestik ICP 2120 is a moisture cure ECA that is made to deliver strong electrical grounding performance. This property is essential for protecting the thin, miniature substrates found in mobile device camera components.