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A soft, malleable, ductile metal with a high thermal and electrical conductivity is high purity copper. Pure copper has a reddish-orange tint when it is first exposed to the air.
As a heat- and electricity-conducting material, copper is also used for construction. It is also a component of several metal alloys, including cupronickel, which is used to create coins and naval hardware, and constantan, which is used in strain gauges and thermocouples for temperature measurement.
Due to its low yield strength of 33 MPa and roughly 210 MPa ultimate strength, high pure copper is not very useful in industrial applications. But copper may be strengthened, just like other alloys. The primary mechanism for strengthening is alloying in Cu-based alloys.
Metal with a high degree of purity is obtained by the electrolytic refining process. The impure copper is created from the anode during the electrolytic refining of copper using copper sulfate (CuSO4) and sulfuric acid (H2SO4) as the electrolyte bath.
The Global Electrolytic Copper market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Processes that have been successfully used in production include the MacuSpecTM VF, AVF, and VF-TH series, which are designed especially to fill blind micro vias. Additionally, through-hole plating is possible with the VF-TH series processes in the same bath.
The VF-TH Series are copper plating baths with excellent physical characteristics that can concurrently fill copper micro vias and plate through holes with aspect ratios of up to 5:1.
The number of processing steps is decreased using MacuSpec VF-TH technology without compromising reliability. By depositing a layer that is resistant to V-pitting during etching, the MacuSpec VF-TH 300 technique also does away with post plating annealing.
The copper that is deposited using the VF-TH Series baths has outstanding physical qualities and satisfies the requirements of IPC 6012D, DS, and 6013D.
For high density interconnects, the MacuSpec AVF series uses sophisticated through fill copper metallization techniques. Under a variety of plating circumstances, the AVF technique provides for minimal surface copper.
Customers can plate a wide range of blind micro through diameters in only one bath without the use of a flash plate thanks to a special combination of chemical ingredients and equipment characteristics.The AVF series baths produce filled micro vias with a remarkable level of repeatability and adhere to the IPC 6012D 126.96.36.199 standard.
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