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When used to encapsulate, pot, and seal components, epoxy encapsulants often offer solid and trustworthy bonding with great moisture and chemical resistance and minimal shrinkage.
Versatile epoxies can be utilized in a wide range of applications, including potting compounds for transformers, underfill encapsulants to reduce thermal stress, glob top encapsulants for fragile chip components, and more.
The Global Epoxy Encapsulants market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Taking advantage of Electro lube’s rapid expansion in India, the electro-chemicals expert will exhibit its most recent developments in encapsulating resins at India’s Electronics Week on stand 1-32.
The company’s manufacturing facility in Bangalore created the ground-breaking new resins using locally obtained resources to assure highly competitive price and delivery within impressively short lead times.
The Indian team at Electro lube took use of the group’s technical assistance and significant local expertise to develop a number of affordable new resins with greater specifications than competing goods.
The new encapsulants carry a full seal of approval from the UK parent company for quality and innovation compliant with widely accepted standards, and have been produced to meet customers’ requirements in terms of performance, financial constraints, and production methodologies.
The SC4004 and SC4003 silicone encapsulating resins from Electro lube are particularly well suited for power supply and automotive applications.
In contrast to Dow Corning’s CN-8760, SC4004 has a wide temperature range of up to +2200C for brief excursions of up to 30 minutes and has a high level of thermal conductivity (1.0 W/m.K), enabling effective heat dissipation.
The SC4003 complies with UL94 V-0 and has a temperature range of -60 to +2000C (up to +2200C for brief excursions of up to 30 minutes). Considering the market’s rising silicone prices, both silicone products offer user-friendly 1:1 ratios with the added benefit of quick cure mechanisms at room temperature.
