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DRAM (dynamic random access memory) is a type of semiconductor memory that stores data or program code that a computer processor needs to function. DRAM is a form of RAM that is commonly found in computers, workstations, and servers.
When constructing embedded computer systems for aerospace and defence applications, it’s customary to employ down-board DRAMs because they’re incredibly reliable, have high thermal efficiency, and have the fastest electrical characteristics.
While using DRAM modules instead of down-board DRAMs is advantageous, an increasing number of design engineers are doing so. Although there are numerous advantages to using down-board DRAM, the full characteristics of DRAM modules provide substantial advantages in areas such as scalability and system density, as well as heat management, environmental protection, testing, and cost.
The Europe DRAM Module and Component Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2026, registering a CAGR of XX% from 2024 to 2030.
Samsung Electronics has created the industry’s first 512 GB Compute Express Link (CXL) DRAM module. This is a key step in commercializing CXL, which will allow IT systems to have exceptionally high memory capacity with low latency.
The 512GB CXL DRAM, which will be available in an EDSFF form factor for next-generation high-capacity enterprise servers and data centers, will be the first memory device to support the PCIe 5.0 interface.
The initial CXL DRAM prototype featured 128GB of memory and was controlled by a field-programmable gate array (FPGA). Samsung has been working with data center, enterprise server, and chipset businesses to upgrade and customize the CXL ASIC since then.
