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Radiation-Hardened Electronics are additionally insulated in a layer of depleted boron and installed on insulating substrates rather than typical semiconductor wafers as part of the “hardening” process.
This allows them to endure far more radiation than commercially available semiconductors.
All of these efforts are aimed at preventing both physical and logical harm, such as data loss or communications and processing failures, which could cause equipment to malfunction.
The Europe Radiation-Hardened Electronics Market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2026, registering a CAGR of XX% from 2022 to 2027.
STMicroelectronics (ST) has released low-cost radiation-hardened integrated circuits for ‘New Space’ satellites.
ST is making it easier to design and mass produce a new generation of reliable small, low-cost satellites that will supply services like earth observation and broadband internet from low-earth orbits (LEOs).
The electronic circuitry of the satellites relies heavily on ST’s new generation of radiation-hardened power, analogue, and logic ICs in low-cost plastic packages.
Renesas Electronics Corporation, a leading provider of advanced semiconductor solutions, has introduced a new range of radiation-hardened (rad-hard) devices for satellite power management systems that are packaged in plastic.
The ISL71001SLHM/SEHM point of load (POL) buck regulator, the ISL71610SLHM and ISL71710SLHM digital isolators, and the ISL73033SLHM 100V GaN FET and integrated low-side driver are among the four new products.
The new portfolio delivers space-grade solutions to medium/geosynchronous Earth orbit (MEO/GEO) missions with extended lifetime requirements, as well as small satellites (smallsats) and higher density electronics, while reducing size, weight, and power (SWaP) costs.
