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Radiation-Hardened Electronics are additionally insulated in a layer of depleted boron and installed on insulating substrates rather than typical semiconductor wafers as part of the “hardening” process.
This allows them to endure far more radiation than commercially available semiconductors.
All of these efforts are aimed at preventing both physical and logical harm, such as data loss or communications and processing failures, which could cause equipment to malfunction.
The Europe Radiation-Hardened Electronics Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
STMicroelectronics (ST) has released low-cost radiation-hardened integrated circuits for ‘New Space’ satellites. ST is making it easier to design and mass produce a new generation of reliable small, low-cost satellites that will supply services like earth observation and broadband internet from low-earth orbits (LEOs).
The electronic circuitry of the satellites relies heavily on ST’s new generation of radiation-hardened power, analogue, and logic ICs in low-cost plastic packages.
Renesas Electronics Corporation, a leading provider of advanced semiconductor solutions, has introduced a new range of radiation-hardened (rad-hard) devices for satellite power management systems that are packaged in plastic.
The ISL71001SLHM/SEHM point of load (POL) buck regulator, the ISL71610SLHM and ISL71710SLHM digital isolators, and the ISL73033SLHM 100V GaN FET and integrated low-side driver are among the four new products.
The new portfolio delivers space-grade solutions to medium/geosynchronous Earth orbit (MEO/GEO) missions with extended lifetime requirements, as well as small satellites (smallsats) and higher density electronics, while reducing size, weight, and power (SWaP) costs.
High-Performance, Radiation-Hardened Electronics for Space and Lunar Environments. The Radiation Hardened Electronics for Space Environments (RHESE) project creates the cutting-edge technologies necessary for high-performance electronic equipment that can function in the harsh radiation and heat extremes of the space, lunar, and Martian environments.
The avionics within numerous mission elements of NASA’s Vision for Space Exploration, including the Orion Crew Exploration Vehicle of the Constellation programme, the Lunar Lander project, Lunar Outpost elements, and Extra Vehicular Activity (EVA) elements, are enhanced and made possible by the technologies developed under this project.
The RHESE project, its many goals, technological methodologies, and desired advantages as they relate to NASA missions are all described in this document. The NASA Exploration technological Development Programme (ETDP) includes several technological development initiatives, including the RHESE project.
This programme exists to guarantee that the necessary enabling and enhancing technologies are available to support NASA’s current and future missions. A wide range of methods for protecting space electronics from the radiation and heat extremes of the space environment are offered by the RHESE project.
New materials, design methodologies, strategies for reconfigurable hardware, and software modelling tools are all examples of hardening approaches.
The missions being developed under NASA’s Constellation programme within the Exploration Mission Systems Directorate (ESMD), including the lunar and Mars missions that will serve to achieve the goals of the Vision for Space Exploration, will be the primary customers of RHESE technologies (NASA, 2004).
The lunar capabilities of the Orion Crew Exploration Vehicle (CEV), the Lunar Lander project, Lunar Outpost components, and Extra Vehicular Activity (EVA) components are all applicable Constellation programme tasks.
RHESE technology also finds use in NASA research missions, joint projects with other US government organisations, and commercial applications. The RHESE project is overseen by the Marshall Space Flight Centre (MSFC) of NASA.
