By submitting this form, you are agreeing to the Terms of Use and Privacy Policy.
Coming Soon
Metal percentages vary across lead-free solder compositions. Tin, copper, silver, nickel, and zinc can be components. With a melting point of 217°C, tin-copper is the most popular lead-free alloy.
Lead-free solders have characteristics that set them apart from conventional lead-tin alloys. In the soldering of electronic components and electronic packaging, lead-free solder alloys have gained popularity and have been widely embraced as an alternative to lead-based solder alloys.
Lead-free solder has a higher melting point than lead alloys, which is 217°C. Because of this, working with lead-free solder is more difficult. Tin-copper, which has a melting point of 217°C and contains 99.3% tin and 0.7% copper, is the most popular lead-free solder mixture.
The Global EV Lead-Free Solder Paste market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Introducing its new lead-free, no-clean soldering and bonding materials is Alpha Assembly Solutions, a global pioneer in the development of electronic soldering and bonding materials.
Introducing its new lead-free, no-clean solder paste technologies is Alpha Assembly Solutions, a global pioneer in the development of electronic soldering and bonding materials.
For assemblies sensitive to component warpage or processes requiring cleaning, ALPHA® OM-353 is a solder paste with an ultra-fine feature print and air reflow capability. Excellent printing results have been tested down to a 180-m pad size.
Low temperature reflow applications benefit greatly from the exceptional drop shock resistance and electrical dependability of ALPHA® OM-535, a low temperature paste. Even when utilising long/high heat soaking, it produces good flux residue and solder joint cosmetics.
These pastes were created in order to meet the performance requirements and new printing problems. “Each offers special qualities to allay reliability worries.
High pick-and-place yields and strong self-alignment are guaranteed by OM-353’s excellent transfer efficiency with tiny area ratios.
By enhancing the mechanical performance and cosmetics utilising low temperature process settings, the enhanced properties of low temperature SBX02 alloy in conjunction with the advanced chemical performance of OM-535 enable the construction of a better solder bond.
Lead-free solder paste ALPHA EF-2211 was created especially for use in electric vehicle applications. Even in challenging automotive conditions, the device is renowned for its excellent dependability and exceptional performance. This zero-halogen solder paste provides good wetting and coalescence, making it a great option for applications on electric vehicles. Wetting refers to the capacity of the solder paste to cling to the component’s or substrate’s surface during the reflow process.
The capacity of the solder paste to create a continuous and uniform solder junction is referred to as coalescence, on the other hand. In order to achieve a trustworthy and durable solder junction, wetting and coalescence work best together, especially in the reliability-sensitive applications of electric vehicles. The ALPHA EF-2211 performs superbly in challenging automotive conditions.
The device is made to survive thermal shock and high temperature cycling, which are frequent in applications for electric vehicles. Since they need high-reliability parts that can survive the demands of the automotive environment, electric vehicle manufacturers may choose this option with confidence.
ALPHA EF-2211 is also a zero-halogen solder paste, meaning it doesn’t include any halogens like bromine or chlorine. Halogens are known to contribute to the development of corrosive leftovers, which over time may cause dependability problems. Even in tough automotive conditions, ALPHA EF-2211’s elimination of halogens makes sure that the solder connection is dependable and free of any corrosive residues.
For use in electric vehicle applications, ALPHA OM-550-T is a high-performance, halogen-free, lead-free solder paste. It is the perfect option for demanding assembly applications since it is made with cutting-edge materials that provide superior wetting and coalescence. Even under difficult working conditions, the solder paste is particularly made to provide dependable performance.
One of the primary characteristics of ALPHA OM-550-T is its capacity for superior wetting and coalescence, which enables it to produce solder junctions that are durable and dependable. High-quality, low-voiding solder junctions are produced by the solder paste, which is made up of a special mixture of flux and metal particles.
This guarantees that the parts of the electric car are attached securely, which is essential for the vehicle’s functionality and safety. The ALPHA® OM-550-T’s capacity to reliably function in challenging operating situations is another benefit. High temperatures, thermal cycling, and vibrations are all factors that can affect how well solder junctions operate in electric vehicles.
The solder connections will stay sturdy and dependable for the duration of the vehicle thanks to ALPHA OM-550-T’s design, which is made expressly to endure these circumstances. Additionally, ALPHA OM-550-T is halogen-free, making it an ecologically beneficial choice for producers of electric vehicles.
Halogens can create corrosion and reliability problems in electronic components and are recognized to be bad for the environment. ALPHA OM-550-T, on the other hand, is a safer and more dependable alternative for electric car assembly because it doesn’t include halogens.
For high-reliability applications like medical devices and military electronics, Kester created NXG2, a no-clean, halogen-free, lead-free solder paste. Strong and reliable connections between electronic components and PCBs are made possible by its outstanding wetting ability and solderability.
NXG2 is appropriate for usage in harsh situations due to its high level of thermal and electrical performance. Its no-clean design minimizes the need for additional cleaning procedures throughout the assembly process, while its halogen-free composition assures compliance with environmental regulations. For high-performance electronic assembly, NXG2 is an all-around dependable and flexible choice.
