FINE-PITCH BALL GRID ARRAY (FBGA) PACKAGING MARKET

INTRODUCTION

A more compact variant of the ball grid array packaging is the fine pitch ball grid array, often known as the FPBGA or FBGA. For external electrical connection, FBGA packages, like all BGA packages, use solder balls that are placed in a grid or array at the bottom of the package body.

The FBGA, on the other hand, has a body that is both smaller and thinner than the typical BGA package and is nearly chip-scale in size. As suggested by its name, it also has a finer ball pitch with fewer balls between each other. Surface-mount packaging for integrated circuits is a ball grid array.

Devices like microprocessors are permanently mounted using BGA packaging. A BGA can offer more connector pins than a dual in-line or flat package can accommodate. Instead of simply the edge, the entire bottom surface of the gadget can be used.

Also, compared to a perimeter-only type, the traces connecting the package's leads to the wires or balls that connect the die to the package are typically shorter, improving performance at high speeds.

The pin grid array, which is a package having one face covered with pins arranged in a grid pattern and used to carry electrical signals between integrated circuits and the printed circuit board on which they are mounted, is the ancestor of the BGA. With a BGA, tiny solder balls are initially adhered to each of the pads on the package's bottom that replace the pins. 

FINE-PITCH BALL GRID ARRAY (FBGA) PACKAGING MARKET SIZE AND FORECAST

 The Global Fine-Pitch Ball Grid Array (FBGA) Packaging market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

FINE-PITCH BALL GRID ARRAY (FBGA) PACKAGING MARKET NEW PRODUCT LAUNCH

JEDEC launched new technology FBGA Fabricators are slim, light, and compact packaging. Flexible body sizes are in square or rectangular shapes and range in size from 3 x 3mm to 23 x 23mm. ball pitch of 0.40, 0.50, 0.65, 0.75, 0.80, and 1.00 mm. Pb-free and eutectic solder balls. Green bundle is offered.

For increased electrical performance, BT laminate materials are available with multiple routing layers and dedicated ground/power planes. according to JEDEC standards. Space-saving, cost-effective package solution with array molding.

Available in maximum thicknesses of 1.40mm, 1.20mm, 1.00mm, 0.80mm, 0.65mm, and 0.50mm. a laminate substrate-based package with flexible routing for 1, 2, 3, and 4 layers. 

FINE-PITCH BALL GRID ARRAY (FBGA) PACKAGING MARKET COMPANY PROFILE

• JEDEC
• OME
• Intel
• Texan Instruments.
• Infineon Technologies, Inc.

THIS FINE-PITCH BALL GRID ARREY (FBGA) PACKAGING MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Fine-Pitch Ball Grid Array (FBGA) Packaging  are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Fine-Pitch Ball Grid Array (FBGA) Packaging  and key vendor selection criteria
3. Where is the Fine-Pitch Ball Grid Array (FBGA) Packaging  manufactured? What is the average margin per unit?
4. Market share of Global Fine-Pitch Ball Grid Array (FBGA) Packaging  market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Fine-Pitch Ball Grid Array (FBGA) Packaging  in-house
6. key predictions for next 5 years in Global Fine-Pitch Ball Grid Array (FBGA) Packaging  market
7. Average B-2-B Fine-Pitch Ball Grid Array (FBGA) Packaging  market price in all segments
8. Latest trends in Fine-Pitch Ball Grid Array (FBGA) Packaging  market, by every market segment
9. The market size (both volume and value) of the Fine-Pitch Ball Grid Array (FBGA) Packaging  market in 2024-2030 and every year in between?
10. Production breakup of Fine-Pitch Ball Grid Array (FBGA) Packaging  market, by suppliers and their OEM relationship