Technology is constantly changing. The industrial sectors adapt to new technologies, and businesses concentrate on the most in-demand applications on the market, shifting their production focus to meet consumer demand.
The need for solutions that offer better thermal dissipation, reliability, and thermal stability is driven by the rising demand for electric and hybrid vehicles and 5G communication (bond joint temperatures can reach 175°C with a 50-100°C delta in a matter of seconds or minutes).
Because AG has the best electrical conductivity, the second-best thermal conductivity, and the highest thermal stability, it has garnered interest as a pure silver sintering die attach paste.
Additionally, the pure metallic bond created at the interface offered significantly higher reliability than solder.
GLOBAL FULL-SINTERING DIE ATTACH PASTE MARKET SIZE AND FORECAST
The Global Full-Sintering Die Attach paste market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
NEW PRODUCT LAUNCH
According to customer requirements, the Henkel full silver sintering material SSP2020 can support both pressureless and pressure-assist sintering.
It offers proven dependability, >200W/mk thermal conductivity, and excellent usability even in low-pressure environments. For improved conductivity in electronic applications, they also provide full-sintering silver die attach paste.
ALPHA Argomax 5022 Paste is a silver sintering die attach paste made especially for copper finish surfaces that require low pressure sintering.
For low pressure sintering die attachment on dried paste applied to copper finished DBC substrates, ALPHA Argomax 5022 Paste is specifically made. For improved attachment reliability with regular DBC without a gold or silver finish, it is formulated with Alpha’s unique engineered silver particles.
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