FULL-SINTERING DIE ATTACH PASTE MARKET

INTRODUCTION

Technology is constantly changing. The industrial sectors adapt to new technologies, and businesses concentrate on the most in-demand applications on the market, shifting their production focus to meet consumer demand. 

The need for solutions that offer better thermal dissipation, reliability, and thermal stability is driven by the rising demand for electric and hybrid vehicles and 5G communication (bond joint temperatures can reach 175°C with a 50-100°C delta in a matter of seconds or minutes).

Because AG has the best electrical conductivity, the second-best thermal conductivity, and the highest thermal stability, it has garnered interest as a pure silver sintering die attach paste.

Additionally, the pure metallic bond created at the interface offered significantly higher reliability than solder.

FULL-SINTERING DIE ATTACH PASTE MARKET SIZE AND FORECAST

The Global Full-Sintering Die Attach paste market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

FULL-SINTERING DIE ATTACH PASTE MARKET NEW PRODUCT LAUNCH

According to customer requirements, the Henkel full silver sintering material SSP2020 can support both pressure less and pressure-assist sintering.

It offers proven dependability, >200W/mk thermal conductivity, and excellent usability even in low-pressure environments. For improved conductivity in electronic applications, they also provide full-sintering silver die attach paste.

ALPHA Argo max 5022 Paste is a silver sintering die attach paste made especially for copper finish surfaces that require low pressure sintering.

For low pressure sintering die attachment on dried paste applied to copper finished DBC substrates, ALPHA Argo max 5022 Paste is specifically made. For improved attachment reliability with regular DBC without a gold or silver finish, it is formulated with Alpha's unique engineered silver particles.

FULL-SINTERING DIE ATTACH PASTE MARKET COMPANY PROFILE

• Delo Industrie Klebstoffe GmbH & Co. KGaA
•  Indium Corporation
• BE Semiconductor Industries N.V.
•  The Dow Chemical Company
•  Hybond Inc.
• SMIC
• Shenzhen Vital New Material

THIS FULL-SINTERING DIE ATTACH PASTE MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. What is the average cost perGlobal Full-Sintering Die Attach paste marketright now and how will it change in the next 5-6 years?
2. Average cost to set up aGlobal Full-Sintering Die Attach paste marketin the US, Europe and China?
3. How manyGlobal Full-Sintering Die Attach paste marketare manufactured per annum globally? Who are the sub-component suppliers in different regions?
4. What is happening in the overall public, globally?
5. Cost breakup of aGlobal Full-Sintering Die Attach paste marketand key vendor selection criteria
6. Where is theGlobal Full-Sintering Die Attach paste market manufactured? What is the average margin per equipment?
7. Market share ofGlobal Full-Sintering Die Attach paste marketmanufacturers and their upcoming products
8. The most important plannedGlobal Full-Sintering Die Attach paste marketin next 2 years
9. Details on network of majorGlobal Full-Sintering Die Attach paste marketand pricing plans
10. Cost advantage for OEMs who manufactureGlobal Full-Sintering Die Attach paste marketin-house
11. 5 key predictions for next 5 years inGlobal Full-Sintering Die Attach paste market
12. Average B-2-BGlobal Full-Sintering Die Attach paste marketprice in all segments
13. Latest trends inGlobal Full-Sintering Die Attach paste market, by every market segment
14. The market size (both volume and value) ofGlobal Full-Sintering Die Attach paste marketin 2024-2030 and every year in between?
15. Global production breakup ofGlobal Full-Sintering Die Attach paste market, by suppliers and their OEM relationship