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Germanium wafers are a particularly desirable semiconductor because of their distinctive qualities. Ge wafers are light and mechanically robust. Additionally, these wafers have the capacity to be manufactured with a 300 mm diameter. Germanium wafers are utilised in a wide range of applications due to its exceptional crystallographic and distinctive electric characteristics.
Space solar cells, terrestrial solar cells (CPV), sensors, infrared optics, high brightness LEDS, and many more semiconductor applications are some specialised uses for germanium wafers. The most common form of electrical grade Germanium is a wafer or substrate. It is a component in the production of solar cells. It is a suitable option for producing thin films for household solar cells as well.
The Global Germanium wafer Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
One of the factors pushing the switch from GaAs to Germanium wafers is the increase in VCSEL array sizes and costs, which will improve the working distance of these sensors. Defect-free 6″ Germanium wafers outperform GaAs wafers in terms of performance and process costs for extremely demanding applications like VCSELs.
The metalloid germanium, which resembles the elements silicon and tin, is shiny, solid, and grey. It is regarded as a crucial component for technological advancements. Different electronic devices use elemental Germanium as a semiconductor.
The first semiconductor circuits were built of germanium and were used in early recordings. Today, materials like gallium arsenide and silicon are also commonly employed.Space solar cells, terrestrial solar cells, infrared optics, sensors, high-brightness LEDs, and other products can all be made using germanium wafers. It is helpful in organometallic chemistry and employed in the creation of nanowires.
It is not simple to turn an element into tiny wafers with a clean, damage-free surface that resembles a mirror. There are several steps involved.The substance becomes a germanium crystal by the Czochralski process. Through the use of cutting, grinding, and etching, the crystal is turned into a wafer. It is cleaned and inspected by the Ge wafers.
Depending on the needs of the customer, this procedure may require polishing the wafers on either one or both sides.The premium wafers are arranged in single wafer containers and stored in a nitrogen environment.
Germanium wafers are utilised in a wide range of applications due to its exceptional crystallographic and distinctive electric characteristics. Space solar cells, terrestrial solar cells (CPV), sensors, infrared optics, high brightness LEDS, and many more semiconductor applications are some specialised uses for germanium wafers.
The Germanium system comes in three anti-reflection coating options: 3 – 5 m for mid-infrared applications, 3 – 12 m for broadband multispectral applications, and 8 – 12 m for thermal imaging applications. Ge wafer with a diameter of 55 mm and a thickness of 1 mm in the image has an AR coating on both surfaces at a thickness of 7 to 14 m, with a Tavg of greater than 95%.
An anti-reflection coating is advised for these ge windows to provide adequate transmission due to their high index of refraction. Germanium experiences thermal runaway, which causes the gearbox to drop as temperature rises. The recommended operating temperature for these germanium windows is below 100°C.
When developing for weight-sensitive systems, germanium’s high density (5.33 g/cm3) should be taken into account. Due to its higher Knoop Hardness (780) than magnesium fluoride, germanium is the perfect material for infrared applications.
Certain characteristics of the Ge substrate need to be developed for the existing and next solar cell technologies produced in Europe. Additionally, this work will support UMICORE in retaining its leadership position and competitiveness in a market that is getting more and more competitive, thereby ensuring Europe’s independence in this essential component for high efficiency solar cells.
To raise the quality with a noticeable increase in yield at the solar cell producer; to make the Ge-substrates cost-effective. Improved round edge wheel performance (less breakage), more homogenous surface grinding, greater throughput, and more cost-effective intrinsic stress alleviation all contribute to increased wafer strength.
The wafer’s surface was improved by lowering the prevalence of surface flaws. Cleaning has increased by using optimised particle and metal cleaning and wafer drying based on surface tension gradient; polishing has also been improved by using better-suited chemicals and polishing pads; and cleaning has increased by using optimised particle and metal cleaning. increased solar cell production yield and better substrate quality.
Costs have implicitly decreased as the production of solar cells has increased. The production of solar cells in Europe remains independent because of this activity.
