Global HBM-PIM Memory Market 2024-2030

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    HBM-PIM Memory Market



    HBM-PIM incorporates the AI processing function to improve high-speed data processing in supercomputers and AI applications. High-bandwidth memory (HBM) is the world’s fastest DRAM, designed for applications that require the highest possible bandwidth between memory and processing.


    This performance is achieved by combining TSV stacked memory dies with logic in the same chip package. High Bandwidth Memory (HBM) is a high-speed computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) 



    infographic: HBM-PIM Memory Market , HBM-PIM Memory Market Size, HBM-PIM Memory Market Trends, HBM-PIM Memory Market Forecast, HBM-PIM Memory Market Risks, HBM-PIM Memory Market Report, HBM-PIM Memory Market Share.


    The Global HBM-PIM memory market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.



    Samsung unveils high-bandwidth memory and a processing-in-memory architecture. Samsung Electronics has announced the development of a new type of memory chip architecture known as high-bandwidth memory, processing-in-memory—HBM-PIM—on its Newsroom webpage.


    Artificial intelligence processing is added to high-bandwidth memory chips via this architecture. The new chips will be marketed as a means of speeding up data centres, increasing the speed of high-performance computers, and enabling AI applications.


    Computer engineers have long worked to eliminate bottlenecks in computers caused by the need to shuffle data back and forth between a computer’s CPU and memory chips. Most efforts have focused on adding small amounts of fast memory caches to CPUs; however, doing so increases energy consumption, resulting in more heat production.


    In this new effort, the Samsung team has taken the opposite approach, allowing memory chips to do some of the processing. Samsung has put “a DRAM optimised AI engine inside of a memory bank” with the new HBM-PIM.This reduces the CPU’s processing load by offloading some of its work to remote databanks.


    Not only is the workload reduced, but the processing speed is increased due to reduced data movement. The HBM-PIM has a PCU that runs at 300MHz and is controlled by the host CPU using conventional memory commands. Using this method, the PCU can be instructed to perform FP16 calculations directly inside the DRAM unit. Notably, the HBM-PIM can function as normal RAM when a system is running non-HBM-PIM applications.


    According to Samsung, when the new technology was tested with their existing HBM2 Aquabolt systems, system performance doubled and energy consumption was reduced by 70%.


    They also stated that installing HBM-PIMs in existing systems would necessitate no changes to existing hardware or software. Their HBM-PIM technology is currently being tested with previously developed AI accelerators developed by AI solution partners; results are expected in the first half of this year.





    1. How many HBM-PIM memory are manufactured per annum globally? Who are the sub-component suppliers in different regions?
    2. Cost breakup of a Global HBM-PIM memory and key vendor selection criteria
    3. Where is the HBM-PIM memory manufactured? What is the average margin per unit?
    4. Market share of Global HBM-PIM memory market manufacturers and their upcoming products
    5. Cost advantage for OEMs who manufacture Global HBM-PIM memory in-house
    6. key predictions for next 5 years in Global HBM-PIM memory market
    7. Average B-2-B HBM-PIM memory market price in all segments
    8. Latest trends in HBM-PIM memory market, by every market segment
    9. The market size (both volume and value) of the HBM-PIM memory market in 2024-2030 and every year in between?
    10. Production breakup of HBM-PIM memory market, by suppliers and their OEM relationship


    Sl no Topic
    1 Market Segmentation
    2 Scope of the report
    3 Abbreviations
    4 Research Methodology
    5 Executive Summary
    6 Introduction
    7 Insights from Industry stakeholders
    8 Cost breakdown of Product by sub-components and average profit margin
    9 Disruptive innovation in the Industry
    10 Technology trends in the Industry
    11 Consumer trends in the industry
    12 Recent Production Milestones
    13 Component Manufacturing in US, EU and China
    14 COVID-19 impact on overall market
    15 COVID-19 impact on Production of components
    16 COVID-19 impact on Point of sale
    17 Market Segmentation, Dynamics and Forecast by Geography, 2024-2030
    18 Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030
    19 Market Segmentation, Dynamics and Forecast by Application, 2024-2030
    20 Market Segmentation, Dynamics and Forecast by End use, 2024-2030
    21 Product installation rate by OEM, 2023
    22 Incline/Decline in Average B-2-B selling price in past 5 years
    23 Competition from substitute products
    24 Gross margin and average profitability of suppliers
    25 New product development in past 12 months
    26 M&A in past 12 months
    27 Growth strategy of leading players
    28 Market share of vendors, 2023
    29 Company Profiles
    30 Unmet needs and opportunity for new suppliers
    31 Conclusion
    32 Appendix
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