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A heat exchanger with a higher cross sectional area, surface area, and volume is commonly known as a heat spreader because it has a high thermal conductivity and is used to transfer heat from a concentrated or high heat flux source to the exchanger. Solid conductors like copper, aluminium, or diamond can act as heat spreaders, as can phase-change components like heat pipes and vapour chambers.
The Global heat spreader market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Launched by Lexar is the Lexar Ares DDR5 desktop memory. According to Ares, DDR5 memory can reach rates of up to 4800 MHz, which is roughly 1.5 times faster than the DDR4 specifications. In order to control RAM thermals and maintain a stable operating temperature for the motherboard and system, it also includes a stylish aluminium heat spreader.
ZADAC sells an M.2 RGB heat spreader. An addressable RGB light source is included into the M.2 heatsink that cools NVMe SSDs.
Power integrity improvements and a heat spreader are included in the Raspberry Pi 3B. These two things work together to increase clock frequencies while improving chip temperature monitoring and management.
The Aeolus family of DDR3-1800MHz/1600MHz overclocking memory modules has been unveiled by Apacer Technology. The most cutting-edge production process technology was used by Micron Technology to create the DDR3 / 1Gbit / 128Mx8 chip used in these modules. The Apacer Aeolus memory modules feature a special, patented active heat spreader design in addition to offering ultra-high speed and ultra-low latency to lower the temperature.
PNY introduced the complete XLR8 series of PC memory for gaming PCs with the introduction of the XLR8 Gaming REV RGB DDR4 overclocked desktop RAM. The new series offers aggressive overclocking, top-tier chips, and frequency frequencies of 3,200 MHz and 3,600 MHz for ever-increasing levels of performance and reliability.
For improved thermal performance, these new modules with ICs from top suppliers are housed in a geometric aluminum heat spreader. The tough aluminum heat spreader assists in heat dissipation during memory-intensive tasks like gaming and video editing as well as installation, safeguarding the delicate components on the modules.
The only commercially available product created especially for the AMD-Xilinx Kria K26 adaptive system on modules (SOMs), the new heatsink from Avnet is now readily available.
The heatsink from Avnet attaches directly to the K26 SOM’s standard heat spreader plate. This “turnkey” solution comes with the mounting hardware and interface “gap” material already attached to the heat sink. The AMD-Xilinx K26 SOM makes it easier and faster to implement advanced SPC applications by streamlining the power and thermal design.
Samsung is releasing its 990 PRO SSD series, which represents the company’s next-generation internal storage. As a follow-up to the 980 PRO heat sink edition, it is said to as the company’s most recent high-performance NVMe SSD and is built on the PCIe 4.0 architecture with “lightning-fast speeds and superior power efficiency.”
In addition to Samsung’s Dynamic Thermal Guard technology, the Samsung 990 PRO SSD has a nickel coating on the controller and a heat spreader label on the drive for thermal management. However, the version with the heatsink also has new RGB lighting and “an additional layer of thermal regulation.”
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