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The use of HLC PCBs, which are PCBs with 12 or more layers, is one way to keep up with the 5G adoption surge. These PCBs are thicker than typical PCBs and frequently have a huge panel size with a back-drilled tiny hole. It is impossible to emphasise the value of precise layer registration tolerances in HLC PCBs.
Additionally, during manufacture, a number of factors, including temperature, humidity, and the precision of registration hole placement, might affect registration and alignment. Extremely small registration tolerances can be accomplished because of rigorous manufacturing process selection and calibration of crucial machinery.
The Global High layer count PCB market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
In order to ensure development and manufacturability, the manufacturing method for high layer count PCBs restricts designers to a specific pad, via, and connection layout.
Although multilayer PCB design options have increased thanks to new manufacturing and quality control techniques, PCB layout experts are encountering barriers to further innovation.
Utilising a novel technique for electronics prototype and high-mix, low-volume manufacture of high layer count PCBs is motivated by the cost, fabrication time, and innovation barriers.
Additionally, as technology develops, design solutions become more complicated, necessitating the use of more sophisticated techniques for developing and manufacturing dependable PCBs.
It takes a lot of plating, etching, pressing, and drilling procedures to produce high layer count PCBs, and each one requires a specific amount of time and resources. Costs for various fabrication processes rise in tandem with layer counts.
For this reason, designers frequently make design compromises in order to keep reliability high and minimise failure risk. Another reason is that designers aim to keep their designs to a minimum number of layers.
As a result, novel design and routing techniques, like VeCS, ELIC, and laser-drilled microvias on multilayer HDI PCBs, have been created. In order to supply the required connectivity density and component density for numerous devices, multilayer PCBs with high layer counts are frequently used in the electronics sector.
