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A non-destructive testing (NDT) imaging method known as 3D x-ray microscopy (XRM) delivers internal, three-dimensional (3D), extremely accurate information in remarkable detail.
Microscopy is used to emphasize a sample’s three-dimensional features. To target a light source, strong light sources like lasers are employed.
The Global high-resolution 3d x-ray microscopy market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
ZEISS Launches New High-resolution 3D X-ray Imaging Solutions for Advanced Semiconductor Packaging Failure Analysis. Semiconductor packaging is required to close the performance gap as the semiconductor industry approaches the CMOS scaling constraints.
The semiconductor industry is turning to package innovation through 3D stacking of chips and other innovative packaging designs to continue developing ever-smaller, quicker, and lower power devices. As a result, package designs become more complicated, leading to additional production difficulties and a higher chance of package failure.
Additionally, traditional approaches for visualizing failure sites are losing their effectiveness since the actual location of problems is frequently hidden within these intricate 3D systems. To effectively pinpoint and identify the primary cause of problems in these sophisticated packages, new methodologies are needed.
In order to give sophisticated package 3D designs with submicron and nanoscale 3D pictures of features and flaws concealed within intact structures, ZEISS has created a new suite of 3D X-ray imaging technologies. This is made possible by rotating the sample and taking several 2D X-ray photos from various angles. Subsequently, 3D volumes are then recreated using advanced mathematical models and algorithms.
An infinite number of virtual cross-sections of the 3D volume may be seen from any angle, offering vital insight into failure areas prior to physical failure analysis (PFA). The combination of ZEISS submicron and nanoscale XRM technologies enables a unique FA process that can greatly improve FA success rates.
Using projection-based geometric magnification, ZEISS’s new X Radia Context micro CT provides outstanding contrast and resolution in a broad field of view, and is completely upgradeable to X Radia Versa.
