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One of the most important links in the manufacturing process of IC integrated chip devices is the appearance quality inspection of the chip, which looks for things like chip pin size, incompleteness, deflection, uneven spacing, and poor flatness.
The quality of circuit products will be directly impacted by problems. A manual visual inspection technique, the traditional chip inspection is prone to issues like missed detection, false detection, and slow speed due to human error.
The majority of industries that make electronic components use machine vision to help with production. This can help reduce costs while also increasing the accuracy and efficiency of micro-level process inspection.
The Global IC appearance inspection system market accounted for $XX Billion in 2024 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The EOTPR 4500, the specialised integrated circuit package inspection system, has been introduced by TeraView, the pioneer and leader in terahertz technology and solutions.
The auto prober technology that they developed to accommodate substrate sizes of up to 150 mm by 150 mm and improve probe tip placement accuracy to +/- 0.5 m is the most important feature of the EOTPR 4500.
This technology was developed in response to the difficulties posed by the most advanced IC packaging technology. Their customers can now probe copper pillars and TSV tips and other chip-let devices with landing contact sizes of less than 5 m using the new auto prober.
Utilizing EOTPR’s industry-leading sub-5 m distance-to-defect capability, this product enables customers to isolate faults in their most advanced IC packaging devices.
Customers working on advanced graphics engines or autonomous driving AI engines can now isolate faults on their devices while simulating the working conditions of these devices thanks to the company’s device under test (DUT) heater, which can reach 250 °C.
