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Image sensor Light sources with a highly uniform light distribution are necessary for the testing, calibration, or characterisation of equipment including image sensors, industrial cameras, hyper-spectral imaging sensors, and optoelectronic detectors.
Full-spectrum quantum efficiency QE, total system gain K, temporal dark noise, signal-to-noise ratio, absolute sensitivity threshold, saturation capacity, dynamic range, DSNU, PRNU, linearity error, and chief-ray angle CRA are some of the parameters that characterise image sensors.
Global image sensor test system market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
IP750Ex-HD Image Sensor Test System it is a reliable fourth-generation test system that offers the most affordable testing while enabling image sensor testing for both present and future products.
Teradyne offers unmatched test knowledge because to its global applications support.
All of which may help to explain why the IP750Ex-HD Image Sensor Test System has regularly been chosen by the image sensor market as their test solution.
The IP750EX-HD is the most affordable platform to suit the requirements of emerging technologies, such as Time of Flight (ToF) sensors, and it has been the test platform that has allowed the industry to build high quality CCD and CMOS image sensors.
The image sensors in your smartphone, high-end digital still camera, or home security and surveillance system were probably put to the test by Teradyne’s IP750ExHD.
Teradyne’s IP750Ex-HD is expanding test coverage as additional features are added to image sensors. Distance ranging, 3D depth sensing, augmented reality (AR), virtual reality (VR), vehicle safety, and advanced driver-assistance systems (ADAS) applications are now all included in the category of “sensing” devices.
The use of numerous cameras and fingerprint scanning cameras for user authentication is growing as a result of mobile applications.
The length of the test is enhanced by the device’s increased complexity. Additionally, the test insertions at the packed device test for low and high temperature tests are increasing for automotive applications.
