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An individual package substrate that is placed on a tray is measured using the in-line substrate bump inspection system.
The global in – line bump inspection system market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Takaoka Toko Co Ltd’s TVI shows an In-tray In-line Bump Inspection System is the type. An individual package substrate that is placed on a tray is measured using the TVI-series in-line substrate bump inspection system (JEDEC). This system has an hourly inspection capacity of 4,500 unique substrate pieces.
In order to accommodate the needs of small and thin substrates, our special inspection technique achieved three-dimensional measurement in the state when a substrate is placed on a tray.
Additionally, this technique can quantify bumps that are both rounded and flat. Takaoka Toko Co., Ltd.’s CVI-series/Index Type In-line Bump Inspection System. An individual package substrate is measured by the CVI-RA series in-line substrate bump inspection equipment while it is being transferred to the index. With high accuracy inspection capabilities, this device can examine 2,700 unique pieces of substrate each hour.
This system is less vulnerable to external noise because it is index type. (C4 area: 16 mm x 11 mm; 21 pieces per tray) It can also quantify bumps that are both rounded and flattened.
New Bump Inspection and Measurement System BIM300 is released by Lasertec. Wafer perimeter inspection, bump formation process optimization, and wafer grinding process optimization are all made possible by the handy inspection and measuring instrument BIM300.
Another usage for BIM300 is the accurate measuring of through glass via (TGV) plating patterns.
