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The term “system on a chip” refers to an integrated circuit or merged circuit that unites the whole electronic or computer system on a single substrate.
It combines the complete system in one chip. Consumers use less power than multi-chip designs because SoC condenses or minimises all multi-chip designs to a single chip or processor. Single-chip devices are also frequently used in Internet of Things (IoT) systems.
The Global IoT SoC Processor market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The availability of Intel’s 12th Gen Intel Core SoC CPUs for IoT Edge has been announced. This first-of-its-kind socketed system-on-chip (SoC) delivers high performance integrated graphics and media processing for visual compute workloads, a small footprint to enable smaller, innovative form factor designs, and a wide operating thermal design power (TDP) that enables fanless designs. It represents a new lineup of purpose-built edge products optimised for Internet of Things (IoT) applications.
For home automation, commercial, and wearable applications, Marvell introduced a highly optimised suite of IoT application processors. The IAP220 System-on-Chip (SoC), designed specifically for Marvell’s IoT Application Processor (IAP) family of products, includes an ARM Cortex-A7 dual-core processor and allows the low-power and high-performance processing required for many IoT solutions.
The Qualcomm QCS603 SoC is a fast IoT System-on-Chip (SoCs) that includes critical characteristics for developing advanced use cases covering machine learning, edge computing, sensor processing, speech UI enablement, and integrated wireless networking.
A wide range of IoT applications benefit from the 10nm QCS603 SoC’s outstanding power and thermal efficiency as it provides strong computation for on-device video processing and machine learning. A strong picture signal processor is included into it.
The new i.MX 8XLite applications processor from NXP Semiconductors has been made available and is targeted towards safe V2X and commercial IoT applications. The SoC integrates NXP’s EdgeLock security and is designed to meet FIPS 140-3 requirements while processing telemetry data and carrying out extremely complicated cryptography.
For cryptographic modules used in many different applications, including V2X and critical infrastructure applications, the U.S. government has established the security standard FIPS 140-3.
The nRF5340 high-end multi-protocol System-on-Chip (SoC), the first of Nordic Semiconductor’s nRF5 Series SoCs, was released. Nordic’s nRF5340 multi-protocol SoC expands on the nRF51 and nRF52 Series while delivering a new flexible, dual-processor hardware architecture with cutting-edge security capabilities.
Bluetooth 5.1/Bluetooth Low Energy (Bluetooth LE), Bluetooth mesh, Thread, and Zigbee are among the RF protocols that the nRF5340 supports. The nRF5340 SoC is made to operate at higher temperatures up to 105°C. Furthermore, the SoC’s application processor and 512 KB of RAM enable it to meet the requirements of the next generation of complex wearables.
A 32 MHz High-Speed SPI peripheral is integrated to interface with displays and sophisticated sensors, while the QSPI peripheral is enhanced to interface with external memory at 96 MHz.
