The land grid array, sometimes known as a pin grid array, is a type of surface-mount packaging for integrated circuits that stands out by having the pins on the socket rather than the integrated circuit itself. A socket or direct soldering to the PCB are two ways that an LGA can be electrically attached to the board.
The land grid array is a packaging technology with a grid of contacts, ‘lands’, on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste.
The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns.
Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowing best shapes for counterpart spring contacts including their outgoing electric connectivity to Unlike pin grid arrays, land grid array packages are designed to fit either in a socket, or be soldered down using surface mount technology.
PGA packages cannot be soldered down using surface mount technology. In contrast with a BGA, land grid array packages in non socketed configurations have no balls, and use flat contacts which are soldered directly to the PCB. BGA packages, however have balls as their contacts in between the IC and the PCBs.
The balls are normally attached to the underside of the IC. Ball grid array and pin grid array packaging are linked to LGA packaging. Land grid array packages, in contrast to pin grid arrays, are made to either fit into a socket or be soldered down using surface mount technology.
It is not possible to use surface mount technology to solder down PGA packages. Unlike a BGA, land grid array packages in non-socketed designs use flat contacts that are soldered directly to the Board instead of balls. Yet, BGA packages’ connections between the IC and the PCBs are balls. Normally, the balls are fastened to the IC’s bottom.
The Global Land Grid Array (LGA) Packaging Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Texas instruments launched the Land Grid Array of F series is a laminate substrate-based package that uses metal pads rather than solder balls for external electrical connection. These metal “lands,” or pads, are positioned at the base of the package body in a grid or array.
The LGA package’s large land count is made possible by the grid-like arrangement of its lands, making it a common packaging choice for devices with high I/O requirements. The Texas Instruments Land Grid Array has 55 available packaging configurations in total.
Surface-mount Sockets for Pitches 0.25mm and larger 30 Grams per Contact Intended to Attach to Packages for Test and Burn-in Good contact with High Hertz-force Concentration is ensured by Normal Force.
Packaging Land Lowest Profile Design and Smallest Footprint Socket Contact Wipes Diameter Densify the sockets more.
Irons Out Surface-mount Design Problems with Coplanarity Using less additional board layers. Ceramic, plastic over-molded, glob top, tape, metal heat sink, and super BGA/LGA packages are all accommodated in sockets that are handler compatible via guideplate adapter kit.
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