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The liquid crystal polymer has the highest level of heat resistance in the world and is the most moldable thin-wall material on the thermoplastic resin market.
It also has the highest strength, elasticity, and dimensional correctness. A low-dielectric LCP resin that has a 65% lower dielectric loss tangent than standard products—0.0007 (@ 10GHz).
It is anticipated that it will be applied to flexible circuit boards and millimeter-wave radar boards, which both need the characteristic of low dielectric, for the wide spread of fifth generation mobile communication systems (5G) and future generation autos.
The Global Low dielectric liquid crystal polymer market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
A number of low-dielectric liquid crystal polymers (LCPs) have been introduced by Polyplastics Co. Ltd., a global provider of engineering thermoplastics with its headquarters in Tokyo, for use in next-generation communication devices.
Laperos E420P is the first in a line of low-dielectric grades for films and connections used in cabling, antennas, and circuit boards that have high flow, low warpage, inherent high-heat resistance, mechanical qualities, and chemical resistance.
For the 1 to 20 GHz frequency band, Laperos E420P employs a mix of formulation and filler technologies to obtain a low dielectric constant of less than 3.0 measured perpendicular to the flow direction.
The dielectric loss tangent is also steady across the whole frequency range. Additionally, the material satisfies the need for shrinking and increasingly intricate designs in connector applications.
