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DRAM-integrated all-in-one memory packages for smartphones. Up to 12 GB of LPDDR4X DRAM and NAND flash storage with a UFS 3.0 interface are now available in the most recent version of uMCP devices, delivering high performance memory for popular handsets in an affordable form size.
UFS-based multi chip packages (uMCPs) incorporate NAND flash storage with a UFS 3.0 interface along with 10 GB or 12 GB of LPDDR4X-4266 memory (manufactured using the company’s 2nd Generation 10nm-class process technology).
Due to the inclusion of four DRAM devices in both of the new uMCP modules, the most recent SoCs with quad-channel LPDDR4X memory controllers will be able to achieve memory bandwidth of up to 34.1 GB/s.,
The GLOBAL LPDDR4X uMCP MARKET accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
First 12 GB LPDDR4X-based uMCP in the market goes into mass production, unsurprisingly built by Samsung.
Samsung LPDDR4X-based uMCP with 12 GB. Four 24 Gb LPDDR4X chips and lightning-fast eUFS 3.0 NAND storage are included in Samsung’s new 12 GB low-power double data rate 4X UFS-based multi chip package.
With a transmission rate of 4,266 Mbps, this new mobile memory technology enables mid-range smartphones to record smooth 4K films and execute AI/machine learning programmes.
Samsung continues to release new products based on cutting-edge technology despite the fact that the global memory market is currently in a downward spiral and Intel may soon overtake Samsung as market leader. The first 12 GB LPDDR4X-based uMCP solution for the market is now ready to go into mass production.
