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Last Updated: Apr 25, 2025 | Study Period: 2023-2030
The preferred interface for this use has emerged as the Mobile Industry Processor Interface MIPI. A wide variety of image sensors, even those that do not naturally support a MIPI interface, are available with VC MIPI camera modules, which are specifically made for use in industrial applications and series goods.
By enabling quicker integration routes with systems on modules and numerous peripheral technologies like wireless and displays, this aids users in hastening the design process.
STARVIS technology achieves high sensitivity by collecting a wider range of light on the photodiode. DOL-HDR technology makes it possible for surveillance camera images to perform at a high level, allowing light and dark areas to coexist while still producing a clear image.
The series combines Sony's industrial-grade 4K CMOS sensors with embedded vision IP. For markets like home robotics and automation, security and surveillance, and autonomous vehicles, they can cut costs, risks, and design time.
A high-bandwidth interface known as MIPI connects host CPUs and cameras. The physical layer of the interface is likewise specified in the MIPI specs, and data is conveyed using differential signals, a dedicated clock, and this layer.
The global MIPI sensor modules market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The first of several MIPI CSI-2 optical modules, the 2-Megapixel Optimum, is now available, according to Teledyne e2v. Powered by Teledyne e2v's own image sensor technology, Optimum has been carefully created to ensure that vision-based embedded systems for robotics, logistics, drones, or laboratory equipment require the least amount of development work possible.
The native MIPI CSI-2 interface and FPC connection of the Optimum 2M make it possible to connect to embedded processing boards. Utilising a specialised Development Kit, which comes with both Linux drivers for simple software integration with NVIDIA Jetson or NXP i.MX solutions and an adapter board for hardware integration, integration can be done instantly.
COMPANY PROFILE
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2023-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2023-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2023-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |