By submitting this form, you are agreeing to the Terms of Use and Privacy Policy.
A neural net processor is a CPU that models how the human brain functions and places it on a single chip. One multi-cored chip may now do all the processing necessary for complicated applications like artificial intelligence (AI), machine learning, or computer vision instead of a vast network of computers.
Convoluted neural networks can currently span several computers and be implemented in a variety of ways using software. These contemporary solutions may make use of several CPUs, GPUs, or even FPGA devices that were specifically developed for speedier parallel processing.
Much to how computers shrank from being monstrously large machines, it is now conceivable to create processors that mirror the human brain’s one million neurons and 256 million synapses on a single chip.
The power needed for neural net computation can be decreased to one-tenth of what was previously needed thanks to this design. For improved efficiency in computer vision applications, other designs, including those from silicon chip design company Synopsys, incorporate embedded vision co-processors in addition to neural net processors.
LED photo sensors, also known as photodetectors or light sensors, are devices that detect and measure light levels. They play a crucial role in various applications, from consumer electronics to industrial automation and beyond. These sensors work by converting light energy into an electrical signal, allowing them to respond to changes in light intensity.
The Global Neural networking processor market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
With its “hundreds of watts”-powered Intel Nirvana NNP AI chip, Intel is aiming for the GPGPU AI industry. Since the beginning of AI inference, GPUs have pretty much controlled the industry. This is understandable given that GPUs are highly parallel processors that are perfect for inference.
However, Intel asserts that the issue with CPU AI performance has been resolved and demonstrated this claim with a competitive benchmark that showed them obtaining a 5x inference performance on a specially designed inference suite. It’s a very huge thing and might herald the start of an AI industry disruption if the GPU in issue was indeed a good one and priced reasonably.
The fact that the new AI chip would only require 100 watts of power is excellent news because power consumption and performance are inversely correlated. Their previous chip could only utilize milliwatts of power.
This indicates that they have successfully produced a performance improvement that will be hundreds of times greater than its forerunner. If the wrench benchmark displayed on screen, which has been accelerated by 5x, is even remotely accurate (on a generalized and repeatable basis), this will significantly alter Intel’s capacity to compete in the AI market.
Mycronic’s MYWizard makes programming accessible to all users, regardless of skill level, and can cut programming time by up to 30%. The thorough test coverage of the MYPro I50 enables pre-reflow and post-reflow 3D inspection of all SMT, THT, and press-fit components.
Due to its incredibly versatile inspection capabilities and MYWizard, its cutting-edge AI-based programming interface, the MYPro I50 makes high-performance 3D AOI accessible to high-mix electronics companies.
The new MYWizard user interface combines two artificial intelligence systems to assist programmers: Auto-Matchmaker, a sophisticated component detection technology, and fresh machine learning algorithms that examine fiducials and component polarity.
When compared to earlier generations, it can cut programming time by up to 30% while also requiring less training and expertise from programmers. For effective process control, the MYPro I series provides best-in-class precision and repeatability in X, Y, Z, and Theta.
Superior critical measurement capabilities are the result of the novel integration of sub-pixel geometric pattern matching technology, proprietary 3D algorithms, and novel warpage and distortion compensation.
The MYPro I series measures the component body, leads, and solder connections with the greatest accuracy possible under comprehensive test coverage to detect any kind of flaws.
The Viscom systems come equipped with outstanding 3D and software features that produce measurements with good precision and images with amazing quality.
The robust offline productivity and data analysis solutions from Omron offer practical ways to work more productively, lower the amount of expertise needed, and improve processes in real ways.
The 3D AOI systems are made to be easy to program and flexible enough to adapt to changing requirements, so they can easily handle quick product changes and high production volumes.
In the context of downsizing, the 3D inspection technique has proven valuable, for instance in presence checks. With the help of a 3D grid, the component is positively identified.
Dealing with distracting reflections and component bodies like chips, which may hide their own solder joints, are additional considerations in this case. According to Viscom’s expertise, it is advantageous to have as many side cameras as possible in order to compute things like the volume of solder junctions and rule out processing errors. In order to achieve this,
Viscom often uses up to eight angled cameras along with 3D strip projection, which prevents lateral errors from appearing in the texture of the 3D image and increases recording speed. Viscom’s exclusive 360View allows the user to choose the viewing angle and always produces an ideally textured image.
A highly scalable and programmable processor for computer vision and artificial intelligence, the VIP9000, has been introduced by VeriSilicon, a Silicon-Platform-as-a-Service firm.
The unique Neural Network (NN) engine and Tensor Processing Fabric technology of the Vivante VIP family provides outstanding neural network inference performance with the best power and area efficiency in the industry, as well as scalable computation capability.
The VIP9000 uses the newest VIP V8 NPU architecture from Vivante. Modern neural networks can adapt to a variety of filter shapes and sizes thanks to the VIP V8 design, which increases the flexibility of data distribution and processing core configurability.
Depending on the design decision, the VIP9000 supports neural network inference with INT8, INT16, Float16, and Bfloat16 data types. Additionally, native support for hybrid quantization (combining data types for neural network operations) is provided by VIP9000.
With so many applications in computer vision, pixel processing for super resolution, audio and voice processing, and other fields, neural network technology is still developing and growing.
Unique licensees have embraced VIP technology in a variety of applications in just a few short years, which is a true testament to the demand for the goods and technology. These applications range from wearable and IoT devices, IP cameras, surveillance cameras, smart homes & appliances, mobile phones, laptops, to automotive and edge servers.
VIP9000 will be useful in sectors where AI Voice, AI Voice, AI Pixel, or AIOT applications are used. VIP9000 provides a number of highly tuned, high precision recognition engines for AIOT and smart home applications.
These new features are included in the release. are a more adaptable core configuration for processing data distribution: enables high MAC usage for a variety of filter shapes and sizes in contemporary neural network models and adds support for the Bfloat16 data format.
Applications running through multiple IPS and Task-specific engines developed for speeding up frequently used AI applications can run on systems using VeriSilicon’s IPS, Video CODEC, NPU, or 3rd party IP complying with FLEXA API with reduced DDR traffics and minimal pixel processing latency.
This enables the identification of faces, face recognition, facial landmarks, objects, and AI voice. Due to VIP9000’s inbuilt support for many tasks and contexts, one or more engines as well as user-defined AI programs can run simultaneously inside the system.
The VIP9000 supports all widely used deep learning frameworks as well as OpenCL and OpenVX programming APIs. The VIP9000 architecture also natively supports neural network optimization techniques including quantization, pruning, and model compression.
The innovative technology improves automobile safety by delivering improved image quality and resolution in external cameras for autonomous driving (AD) and advanced driver assistance systems (ADAS).
The OX08D10 is smaller than other external cabin sensors in its class and has industry-leading low light performance and low power consumption. It is the first image sensor to use OMNIVISION’s innovative 2.1-micron TheiaCel technology, which uses the power of OMNIVISION’s DCG high dynamic range (HDR) technology and next-generation lateral overflow integration capacitors to completely eliminate LED flicker regardless of lighting conditions. The OX08D10 can record HDR images thanks to TheiaCel. This range is ideal for exterior camera applications in automobiles because it provides the best SNR1 and dynamic range balance.
With the introduction of the new OX08D10 image sensor, automotive OEMs now have a single component that combines all of the most crucial features, such as low-light performance, LED flicker mitigation (LFM), small size, and low power, removing the need for our customers to make performance or design sacrifices in order to address LED flicker.
Modern car image sensors must now incorporate LFM, HDR, and high resolution in order to attain increased levels of autonomy. These requirements are met by OMNIVISION’s TheiaCel DCG + LOFIC solution, which is in line with the upcoming trend of adding more external cameras per car.
Flicker from LED traffic lights presents a significant challenge for image solutions in the automotive industry, making it difficult for ADAS and AD systems to accurately detect illuminated traffic signs. To solve this problem, the industry has been begging for a solution that could be quickly integrated into a CMOS image sensor.
While some previous methods produced satisfactory LFM, they also had poor image quality, especially in hot vehicle environments.TheiaCel, a new 2.1-m single-pixel technology from OMNIVISION, provides high LFM without compromising image quality.
TheiaCel makes use of the strengths of OMNIVISION’s unique HDR technology and next-generation LOFIC to record situations with a very high contrast for the best possible content and image quality. A greater dynamic range is achieved than with preceding single-exposure HDR architectures thanks to OMNIVISION’s TheiaCel DCG + LOFIC technology.
The new OX08D10 outperforms its non-LOFIC-based predecessor in particular in a number of critical areas. It has improved cybersecurity in accordance with the most recent MIPI CSE version 2.0 requirements, which add functional safety to the data streams from automobile image sensors. For the smallest possible solution, the TheiaCel gadget uses OMNIVISION’s a-CSP packaging technology.