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The dependability and performance that leadframe and high-density laminate packaging require are provided by a variety of non-conductive die attach paste compositions.
there are goods that are tailored to the specific requirements of those devices because each package type, including BGAs, LGAs, and Smart Cards, has different requirements.
non-conductive Die attach pastes provide a low modulus for minimising stress and eliminating warpage, as well as Bismaleimide (BMI) formulations for minimising moisture absorption to prevent package cracking during high temperature processing.
The Global Non-Conductive Die Attach Pastes market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Henkel has created a broad portfolio of cutting-edge non-conductive die attach pastes to meet a variety of wire bond requirements, including those for laminate and lead frame wire bond packages.
These requirements range from smaller die-to-pad ratios to thinner bond lines to low stress to high temperature capability and robust adhesion. High-reliability is a priority, and LOCTITE ABLESTIK non-conductive die attach pastes can be used to create products that adhere to exacting JEDEC MSL1 specifications.
high-density laminate packages require a wide range of non-conductive LOCTITE ABLESTIK die attach paste formulas that deliver the dependability and performance they need.
Henkel has created a line of solutions that are tailored to the specific requirements of laminate-based devices because each package type, including BGAs, LGAs, and Smart Cards, has different requirements.
Die attach pastes from Henkel have a low modulus to lessen stress and eliminate warpage as well as Bismaleimide (BMI) formulations for low moisture absorption to prevent package cracking during high temperature processing.
