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Due to the sheer growing adoption of the Internet of Things (IoT), the development of internet connectivity, the integration of connectivity in a large number of mobile devices and applications, and technological advancements in 5G networks, artificial intelligence, machine learning, smart homes, and smart cities, the North American IoT chip market is expected to grow.
A field-programmable gate array is the most prevalent form of logic device used to achieve IoT. (FPGA). The term “field-programmable gate array” refers to an IC that can be modified by a client or designer even after it has been manufactured. Hardware description languages, such as VHSIC Hardware Description Language (VHDL) or Verilog, are used to programme FPGAs.
Rapid development, reduced time-to-market, ability to reprogram in the field for debugging, and lengthy product life cycles are all advantages of FPGA. The increased demand for wearables is to blame for the considerable increase in logic device shipments.
The North America IoT Chip Market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2026, registering a CAGR of XX% from 2022 to 2027.
Impinj Inc. has announced the release of the Impinj RAIN RFID reader chip’s next version. The Impinj E710, E510, and E310 reader chips are high-performance, low-power, highly integrated systems-on-chips (SoCs) that enable item connection for hundreds of billions of items throughout the world, including garments, deliveries, medications, automobile components, and more.
These three new RAIN RFID reader chips help IoT device designers fulfil the growing need for item connection in retail, supply chain and logistics, consumer electronics, and a variety of other industries.
The Internet of Things (IoT) has been transforming industries across the globe, and North America remains at the forefront of this technological revolution. IoT chips, essential components that enable devices to communicate and exchange data, play a pivotal role in this ecosystem. In recent times, several partnerships have emerged in the North America IoT chip market, reflecting the dynamic and competitive nature of the industry.
One of the most significant partnerships in the North America IoT chip market is between Qualcomm, a leading semiconductor manufacturer, and Ford, a renowned automotive giant.
The collaboration aims to integrate Qualcomm’s advanced IoT chips into Ford’s vehicles, enabling enhanced connectivity and real-time data exchange. With these IoT chips, Ford vehicles can provide drivers with improved navigation, access to vehicle diagnostics, and integrated smart home capabilities. The partnership seeks to enhance the driving experience, increase vehicle safety, and pave the way for autonomous driving technologies.
Intel, a well-established semiconductor company, joined forces with General Electric, a global conglomerate with diverse business interests, to drive IoT innovation in the industrial sector.
GE’s expertise in manufacturing and industrial solutions combined with Intel’s IoT chip technology promises to revolutionize industries such as aviation, energy, healthcare, and more. By embedding Intel’s IoT chips into GE’s industrial machines and equipment, the collaboration aims to enable predictive maintenance, real-time analytics, and operational efficiency, leading to cost savings and improved productivity.
NVIDIA, known for its cutting-edge graphics processing units (GPUs), partnered with Amazon Web Services (AWS), the leading cloud service provider, to harness the power of IoT and AI in the cloud.
This collaboration seeks to integrate NVIDIA’s high-performance IoT chips with AWS’s cloud infrastructure, enabling businesses to deploy AI-driven IoT applications and manage vast amounts of data efficiently. The joint effort empowers various industries, including healthcare, smart cities, and agriculture, to implement advanced IoT solutions that leverage the computational prowess of NVIDIA GPUs and the scalability of AWS cloud services.
Texas Instruments (TI), a prominent semiconductor company, teamed up with Verizon, a leading telecommunications provider, to propel IoT adoption in North America. The collaboration aims to create optimized IoT solutions by integrating TI’s IoT chips with Verizon’s robust IoT network infrastructure.
This joint effort enables a wide range of applications, from smart cities and industrial automation to healthcare and consumer electronics. By leveraging Verizon’s reliable connectivity and TI’s power-efficient IoT chips, the partnership seeks to accelerate the development and deployment of IoT devices and services.