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During the projection period, North America has the second biggest market share of photolithography equipment. Photolithography equipment is most commonly found in wafer-level packaging, advanced packaging, LED, and MEMS applications.
A lot of officials anticipate increasing development of semiconductor manufacturing technologies in the United States because they are critical to the country’s economic and national security objectives.
The US semiconductor sector leads several phases of the worldwide semiconductor supply chain, including chip design and R&D operations. Furthermore, the United States is one of the leading exporters of semiconductor devices.
The integrated device makers category has a lower proportion of the photolithography equipment market than the foundries segment. This is due to specialist foundries having more technological know-how and economies of scale than integrated foundries.
The NORTH AMERICA PHOTOLITHOGRAPHY EQUIPMENT MARKET accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Intel has taken a sneak peek at fab D1X in Oregon to witness what is expected to be the most complex machine humans have ever made. D1X fab in Oregon
An extreme ultraviolet (EUV) lithography system projects circuit designs onto silicon wafers using dramatically shorter wavelengths – 13.5 nanometer wavelengths, or more than ten times smaller than today’s lithography devices.
The EUV machine advances Moore’s Law, and chip manufacturers cannot build cutting-edge chips without it. It takes three Boeing 747 cargo flights, 40 freight containers, and 20 vehicles to deliver just one of these gadgets to D1X. The school bus-sized machine is made up of 100,000 pieces and weighs close to 200 tones.
These EUV machines are manufactured by ASML. The Dutch business is presently developing the next edition of the gadget, and Intel will be among the first to acquire one.